JPS5510134B2 - - Google Patents

Info

Publication number
JPS5510134B2
JPS5510134B2 JP7972474A JP7972474A JPS5510134B2 JP S5510134 B2 JPS5510134 B2 JP S5510134B2 JP 7972474 A JP7972474 A JP 7972474A JP 7972474 A JP7972474 A JP 7972474A JP S5510134 B2 JPS5510134 B2 JP S5510134B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7972474A
Other languages
Japanese (ja)
Other versions
JPS5040075A (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5040075A publication Critical patent/JPS5040075A/ja
Publication of JPS5510134B2 publication Critical patent/JPS5510134B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/136Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/013Manufacture or treatment of die-attach connectors
    • H10W72/01361Chemical or physical modification, e.g. by sintering or anodisation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07331Connecting techniques
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07331Connecting techniques
    • H10W72/07336Soldering or alloying

Landscapes

  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
JP7972474A 1973-07-16 1974-07-11 Expired JPS5510134B2 (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2336152A DE2336152C3 (de) 1973-07-16 1973-07-16 Halbleiterbauelement

Publications (2)

Publication Number Publication Date
JPS5040075A JPS5040075A (2) 1975-04-12
JPS5510134B2 true JPS5510134B2 (2) 1980-03-14

Family

ID=5887096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7972474A Expired JPS5510134B2 (2) 1973-07-16 1974-07-11

Country Status (8)

Country Link
JP (1) JPS5510134B2 (2)
BE (1) BE817065A (2)
CA (1) CA1015070A (2)
DE (1) DE2336152C3 (2)
FR (1) FR2238248B1 (2)
GB (1) GB1474575A (2)
IT (1) IT1017057B (2)
SE (1) SE395201B (2)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584058Y2 (ja) * 1976-08-10 1983-01-24 株式会社ターダ ガス器具
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
JPS5490732U (2) * 1977-12-12 1979-06-27
JPS6123050U (ja) * 1985-06-17 1986-02-10 株式会社 同和 バ−ナにおける始動消火連動装置

Also Published As

Publication number Publication date
FR2238248B1 (2) 1978-03-24
DE2336152C3 (de) 1979-03-22
SE7409300L (2) 1975-02-21
JPS5040075A (2) 1975-04-12
IT1017057B (it) 1977-07-20
GB1474575A (en) 1977-05-25
FR2238248A1 (2) 1975-02-14
BE817065A (fr) 1974-10-16
SE395201B (sv) 1977-08-01
DE2336152A1 (de) 1975-01-30
DE2336152B2 (de) 1978-07-20
CA1015070A (en) 1977-08-02

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