JPS55102295A - Method of continuously fabricating flexible copper insulated substrate - Google Patents

Method of continuously fabricating flexible copper insulated substrate

Info

Publication number
JPS55102295A
JPS55102295A JP907479A JP907479A JPS55102295A JP S55102295 A JPS55102295 A JP S55102295A JP 907479 A JP907479 A JP 907479A JP 907479 A JP907479 A JP 907479A JP S55102295 A JPS55102295 A JP S55102295A
Authority
JP
Japan
Prior art keywords
insulated substrate
flexible copper
fabricating flexible
copper insulated
continuously fabricating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP907479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5751997B2 (2
Inventor
Hiroshi Shiba
Katsuhiro Murata
Mitsumasa Shibata
Kouichi Hirota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Graphite Industries Ltd
Original Assignee
Nippon Graphite Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Graphite Industries Ltd filed Critical Nippon Graphite Industries Ltd
Priority to JP907479A priority Critical patent/JPS55102295A/ja
Publication of JPS55102295A publication Critical patent/JPS55102295A/ja
Publication of JPS5751997B2 publication Critical patent/JPS5751997B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP907479A 1979-01-31 1979-01-31 Method of continuously fabricating flexible copper insulated substrate Granted JPS55102295A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP907479A JPS55102295A (en) 1979-01-31 1979-01-31 Method of continuously fabricating flexible copper insulated substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP907479A JPS55102295A (en) 1979-01-31 1979-01-31 Method of continuously fabricating flexible copper insulated substrate

Publications (2)

Publication Number Publication Date
JPS55102295A true JPS55102295A (en) 1980-08-05
JPS5751997B2 JPS5751997B2 (2) 1982-11-05

Family

ID=11710451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP907479A Granted JPS55102295A (en) 1979-01-31 1979-01-31 Method of continuously fabricating flexible copper insulated substrate

Country Status (1)

Country Link
JP (1) JPS55102295A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60115439A (ja) * 1983-11-28 1985-06-21 松下電工株式会社 金属箔張り積層板の連続製法
US7080442B2 (en) 1997-09-03 2006-07-25 Hosiden Electronics Co., Ltd. Manufacturing method of acoustic sensor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60115439A (ja) * 1983-11-28 1985-06-21 松下電工株式会社 金属箔張り積層板の連続製法
US7080442B2 (en) 1997-09-03 2006-07-25 Hosiden Electronics Co., Ltd. Manufacturing method of acoustic sensor
US7204009B2 (en) 1997-09-03 2007-04-17 Hosiden Electronics Co., Ltd. Manufacturing method of acoustic sensor

Also Published As

Publication number Publication date
JPS5751997B2 (2) 1982-11-05

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