JPS55102467A - Curing of photosensitive resin layer - Google Patents
Curing of photosensitive resin layerInfo
- Publication number
- JPS55102467A JPS55102467A JP964179A JP964179A JPS55102467A JP S55102467 A JPS55102467 A JP S55102467A JP 964179 A JP964179 A JP 964179A JP 964179 A JP964179 A JP 964179A JP S55102467 A JPS55102467 A JP S55102467A
- Authority
- JP
- Japan
- Prior art keywords
- discharge lamp
- ultraviolet ray
- photosensitive resin
- less
- cured layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Polymerisation Methods In General (AREA)
Abstract
PURPOSE: To produce cured layer having thickness of 100μ or less of good quality in excellent workability and obtain power efficiency by a method wherein liquid photosensitive resin curable by irradiation or ultraviolet ray in the range of wavelength less than 4,500Å is irradiated with specific light energy using flash discharge lamp.
CONSTITUTION: Printing ink, coating material, etc. using uncured liquid photosensitive resin having main photosensitive characteristic in the range of wavelength less than 4,500Å is cured by use of ultraviolet ray irradiation. At this time, instead of conventional mercury discharge lamp as ultraviolet ray irradiation source, cold light source of flash discharge lamp consisting of glass tube containing sealed rare gas such as Xe gas and that provides monentarily total design light quantity is applied. Light energy J (Joule) emitted by the discharge lamp is controlled so that 0.02≤J/S≤8 holds where S(cm2) is the area to be irradiated. In this method, no uncured part remains in photosensitized resin, no deterioration occurs to the cured layer surface, and cured layer less than 100μ in thickness is instantaneously formed, thereby providing excellent workability and power efficiency.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP964179A JPS55102467A (en) | 1979-02-01 | 1979-02-01 | Curing of photosensitive resin layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP964179A JPS55102467A (en) | 1979-02-01 | 1979-02-01 | Curing of photosensitive resin layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55102467A true JPS55102467A (en) | 1980-08-05 |
| JPS6112501B2 JPS6112501B2 (en) | 1986-04-08 |
Family
ID=11725840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP964179A Granted JPS55102467A (en) | 1979-02-01 | 1979-02-01 | Curing of photosensitive resin layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55102467A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4548688A (en) * | 1983-05-23 | 1985-10-22 | Fusion Semiconductor Systems | Hardening of photoresist |
| US5904795A (en) * | 1995-08-15 | 1999-05-18 | Dainippon Ink & Chemicals, Inc. | Disc bonding method and device therefor |
-
1979
- 1979-02-01 JP JP964179A patent/JPS55102467A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4548688A (en) * | 1983-05-23 | 1985-10-22 | Fusion Semiconductor Systems | Hardening of photoresist |
| US5904795A (en) * | 1995-08-15 | 1999-05-18 | Dainippon Ink & Chemicals, Inc. | Disc bonding method and device therefor |
| US6334925B1 (en) | 1995-08-15 | 2002-01-01 | Dainippon Ink & Chemical, Inc. | Disc bonding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6112501B2 (en) | 1986-04-08 |
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