JPS55108745U - - Google Patents
Info
- Publication number
- JPS55108745U JPS55108745U JP1979007570U JP757079U JPS55108745U JP S55108745 U JPS55108745 U JP S55108745U JP 1979007570 U JP1979007570 U JP 1979007570U JP 757079 U JP757079 U JP 757079U JP S55108745 U JPS55108745 U JP S55108745U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979007570U JPS5930538Y2 (ja) | 1979-01-23 | 1979-01-23 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979007570U JPS5930538Y2 (ja) | 1979-01-23 | 1979-01-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55108745U true JPS55108745U (2) | 1980-07-30 |
| JPS5930538Y2 JPS5930538Y2 (ja) | 1984-08-31 |
Family
ID=28815473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979007570U Expired JPS5930538Y2 (ja) | 1979-01-23 | 1979-01-23 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5930538Y2 (2) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60154646A (ja) * | 1984-01-25 | 1985-08-14 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
| WO1986005322A1 (fr) * | 1985-02-28 | 1986-09-12 | Sony Corporation | Dispositif a circuit a semi-conducteurs |
-
1979
- 1979-01-23 JP JP1979007570U patent/JPS5930538Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60154646A (ja) * | 1984-01-25 | 1985-08-14 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
| WO1986005322A1 (fr) * | 1985-02-28 | 1986-09-12 | Sony Corporation | Dispositif a circuit a semi-conducteurs |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5930538Y2 (ja) | 1984-08-31 |