JPS551123A - Method of manufacturing flexible printec circuit board - Google Patents

Method of manufacturing flexible printec circuit board

Info

Publication number
JPS551123A
JPS551123A JP7368978A JP7368978A JPS551123A JP S551123 A JPS551123 A JP S551123A JP 7368978 A JP7368978 A JP 7368978A JP 7368978 A JP7368978 A JP 7368978A JP S551123 A JPS551123 A JP S551123A
Authority
JP
Japan
Prior art keywords
printec
circuit board
manufacturing flexible
flexible
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7368978A
Other languages
Japanese (ja)
Other versions
JPS5749158B2 (en
Inventor
Shigenori Yamaoka
Masuo Mizuno
Kazuto Kitajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP7368978A priority Critical patent/JPS551123A/en
Publication of JPS551123A publication Critical patent/JPS551123A/en
Publication of JPS5749158B2 publication Critical patent/JPS5749158B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP7368978A 1978-06-20 1978-06-20 Method of manufacturing flexible printec circuit board Granted JPS551123A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7368978A JPS551123A (en) 1978-06-20 1978-06-20 Method of manufacturing flexible printec circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7368978A JPS551123A (en) 1978-06-20 1978-06-20 Method of manufacturing flexible printec circuit board

Publications (2)

Publication Number Publication Date
JPS551123A true JPS551123A (en) 1980-01-07
JPS5749158B2 JPS5749158B2 (en) 1982-10-20

Family

ID=13525423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7368978A Granted JPS551123A (en) 1978-06-20 1978-06-20 Method of manufacturing flexible printec circuit board

Country Status (1)

Country Link
JP (1) JPS551123A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3936488A1 (en) * 1989-11-02 1991-05-08 Beck & Co Ag Dr Flexible base material for prodn. of electrical circuits etc. - by coating copper foil with filled polyamide-acid or polyimide base-coat, with similar unfilled top-coat, and stoving combination
JPH09137131A (en) * 1995-11-16 1997-05-27 Matsushita Electric Ind Co Ltd Conductive bonding method using one-pack type epoxy resin adhesive

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3936488A1 (en) * 1989-11-02 1991-05-08 Beck & Co Ag Dr Flexible base material for prodn. of electrical circuits etc. - by coating copper foil with filled polyamide-acid or polyimide base-coat, with similar unfilled top-coat, and stoving combination
JPH09137131A (en) * 1995-11-16 1997-05-27 Matsushita Electric Ind Co Ltd Conductive bonding method using one-pack type epoxy resin adhesive

Also Published As

Publication number Publication date
JPS5749158B2 (en) 1982-10-20

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