JPS5511324A - Manufacturing method of metal header for power semiconductor device and power semiconductor device using it - Google Patents

Manufacturing method of metal header for power semiconductor device and power semiconductor device using it

Info

Publication number
JPS5511324A
JPS5511324A JP8339378A JP8339378A JPS5511324A JP S5511324 A JPS5511324 A JP S5511324A JP 8339378 A JP8339378 A JP 8339378A JP 8339378 A JP8339378 A JP 8339378A JP S5511324 A JPS5511324 A JP S5511324A
Authority
JP
Japan
Prior art keywords
metal
semiconductor device
assembling work
power semiconductor
assembling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8339378A
Other languages
Japanese (ja)
Inventor
Hiroyuki Fujii
Kenichi Tateno
Yukio Hatakeyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP8339378A priority Critical patent/JPS5511324A/en
Publication of JPS5511324A publication Critical patent/JPS5511324A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To make uniform the characteristics of finished products and increase assembling work efficiency, by eliminating discontinuity among metal components, making it possible to operate assembling work continuously, and reducing positional dispersion at the time of assembling.
CONSTITUTION: Both ends of metal header proper 6, which has been punched from a single metal sheet, are connected by connecting band 7. Metal headers proper 6 are connected by connectors 11. Further, through hole 8 for planting lead-out pin 12, and cut-lines 9, 10, which can easily separate connecting bands, are processed so as to facilitate assembling work continuously. By means of sintered glass 15, lead-out pin 12 is insulated and inserted into metal shell 14 fitted with flange 13. Its cap is inserted into through hole 8, and metal shell 14 and metal header proper 6 are welded; and lead-out pin 12 is planted. This assembling work is operated continuously, and thereby positioning at the time of assembling is simplified and the quality of finished products is improved.
COPYRIGHT: (C)1980,JPO&Japio
JP8339378A 1978-07-07 1978-07-07 Manufacturing method of metal header for power semiconductor device and power semiconductor device using it Pending JPS5511324A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8339378A JPS5511324A (en) 1978-07-07 1978-07-07 Manufacturing method of metal header for power semiconductor device and power semiconductor device using it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8339378A JPS5511324A (en) 1978-07-07 1978-07-07 Manufacturing method of metal header for power semiconductor device and power semiconductor device using it

Publications (1)

Publication Number Publication Date
JPS5511324A true JPS5511324A (en) 1980-01-26

Family

ID=13801178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8339378A Pending JPS5511324A (en) 1978-07-07 1978-07-07 Manufacturing method of metal header for power semiconductor device and power semiconductor device using it

Country Status (1)

Country Link
JP (1) JPS5511324A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923745U (en) * 1982-08-02 1984-02-14 ロ−ム株式会社 Stem for semiconductor devices
US5225017A (en) * 1992-02-19 1993-07-06 Ni Fong Ming Method for forming a cover of an umbrella
JPH0664515U (en) * 1992-02-05 1994-09-13 倪 鋒明 Umbrella surface structure made with a single piece of umbrella cloth
JPH0751112A (en) * 1993-01-20 1995-02-28 Homei Gei Formation of seamless umbrella surface by single sheet of umbrella cloth

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923745U (en) * 1982-08-02 1984-02-14 ロ−ム株式会社 Stem for semiconductor devices
JPH0664515U (en) * 1992-02-05 1994-09-13 倪 鋒明 Umbrella surface structure made with a single piece of umbrella cloth
US5225017A (en) * 1992-02-19 1993-07-06 Ni Fong Ming Method for forming a cover of an umbrella
JPH0751112A (en) * 1993-01-20 1995-02-28 Homei Gei Formation of seamless umbrella surface by single sheet of umbrella cloth

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