JPS55125652A - Package for optical semiconductor device - Google Patents

Package for optical semiconductor device

Info

Publication number
JPS55125652A
JPS55125652A JP3311579A JP3311579A JPS55125652A JP S55125652 A JPS55125652 A JP S55125652A JP 3311579 A JP3311579 A JP 3311579A JP 3311579 A JP3311579 A JP 3311579A JP S55125652 A JPS55125652 A JP S55125652A
Authority
JP
Japan
Prior art keywords
optical fiber
package
side portion
cap base
coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3311579A
Other languages
Japanese (ja)
Inventor
Kenji Yano
Toshiaki Kaneko
Takayuki Nakayama
Riyousuke Namazu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3311579A priority Critical patent/JPS55125652A/en
Publication of JPS55125652A publication Critical patent/JPS55125652A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To prevent cracks from occurring in a package for an optical semiconductor device and improve the reliability of the package, by employing sealing glass the coefficient of thermal expansion of which gradually increases from an optical fiber side portion to a cap base side portion thereof. CONSTITUTION:A cylindrical tablet 11 of fusing glass, a cylindrical tablet 12 of borosilicate glass and an optical fiber 4 are inserted into a cap base 6 of so as to be heated. The tablets 11, 12 thus melted is cooled to fix the optical fiber 4. According to this structure, the coefficient of linear expansion of the sealing glass gradually increases from the optical fiber side portion thereof to the cap base side portion thereof, and, therefore, the difference between the coefficient of expansion of each member is small. Accordingly, the heat generated while the cap base is fused to a stem 3 never causes the optical fiber and a sealing glass layer 5 to be cracked. Thus, a package of a high reliability can be obtained.
JP3311579A 1979-03-20 1979-03-20 Package for optical semiconductor device Pending JPS55125652A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3311579A JPS55125652A (en) 1979-03-20 1979-03-20 Package for optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3311579A JPS55125652A (en) 1979-03-20 1979-03-20 Package for optical semiconductor device

Publications (1)

Publication Number Publication Date
JPS55125652A true JPS55125652A (en) 1980-09-27

Family

ID=12377633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3311579A Pending JPS55125652A (en) 1979-03-20 1979-03-20 Package for optical semiconductor device

Country Status (1)

Country Link
JP (1) JPS55125652A (en)

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