JPS5514760U - - Google Patents

Info

Publication number
JPS5514760U
JPS5514760U JP1978097715U JP9771578U JPS5514760U JP S5514760 U JPS5514760 U JP S5514760U JP 1978097715 U JP1978097715 U JP 1978097715U JP 9771578 U JP9771578 U JP 9771578U JP S5514760 U JPS5514760 U JP S5514760U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1978097715U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978097715U priority Critical patent/JPS5514760U/ja
Publication of JPS5514760U publication Critical patent/JPS5514760U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP1978097715U 1978-07-14 1978-07-14 Pending JPS5514760U (mo)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978097715U JPS5514760U (mo) 1978-07-14 1978-07-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978097715U JPS5514760U (mo) 1978-07-14 1978-07-14

Publications (1)

Publication Number Publication Date
JPS5514760U true JPS5514760U (mo) 1980-01-30

Family

ID=29032811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978097715U Pending JPS5514760U (mo) 1978-07-14 1978-07-14

Country Status (1)

Country Link
JP (1) JPS5514760U (mo)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176651U (mo) * 1981-05-01 1982-11-08
JPS5986344U (ja) * 1982-12-01 1984-06-11 日産自動車株式会社 シリンダガスケツト
JPH01154364U (mo) * 1988-04-15 1989-10-24

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176651U (mo) * 1981-05-01 1982-11-08
JPS5986344U (ja) * 1982-12-01 1984-06-11 日産自動車株式会社 シリンダガスケツト
JPH01154364U (mo) * 1988-04-15 1989-10-24

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