JPS55150295A - Method and device for plating through hole of printed circuit board - Google Patents

Method and device for plating through hole of printed circuit board

Info

Publication number
JPS55150295A
JPS55150295A JP5811879A JP5811879A JPS55150295A JP S55150295 A JPS55150295 A JP S55150295A JP 5811879 A JP5811879 A JP 5811879A JP 5811879 A JP5811879 A JP 5811879A JP S55150295 A JPS55150295 A JP S55150295A
Authority
JP
Japan
Prior art keywords
plating
hole
circuit board
printed circuit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5811879A
Other languages
Japanese (ja)
Other versions
JPS5739079B2 (en
Inventor
Masakatsu Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Giken Kogyo KK
Original Assignee
Toyo Giken Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Giken Kogyo KK filed Critical Toyo Giken Kogyo KK
Priority to JP5811879A priority Critical patent/JPS55150295A/en
Publication of JPS55150295A publication Critical patent/JPS55150295A/en
Publication of JPS5739079B2 publication Critical patent/JPS5739079B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP5811879A 1979-05-14 1979-05-14 Method and device for plating through hole of printed circuit board Granted JPS55150295A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5811879A JPS55150295A (en) 1979-05-14 1979-05-14 Method and device for plating through hole of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5811879A JPS55150295A (en) 1979-05-14 1979-05-14 Method and device for plating through hole of printed circuit board

Publications (2)

Publication Number Publication Date
JPS55150295A true JPS55150295A (en) 1980-11-22
JPS5739079B2 JPS5739079B2 (en) 1982-08-19

Family

ID=13075053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5811879A Granted JPS55150295A (en) 1979-05-14 1979-05-14 Method and device for plating through hole of printed circuit board

Country Status (1)

Country Link
JP (1) JPS55150295A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009287098A (en) * 2008-05-30 2009-12-10 I Plant:Kk Plating apparatus
JP2010070779A (en) * 2008-09-16 2010-04-02 National Institute Of Advanced Industrial Science & Technology Defoaming device, bubble removing method, plating method and micro-metallic structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101855442B1 (en) * 2017-12-28 2018-05-09 주식회사 차칵 A method for determining forgeries of media files

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5125772A (en) * 1974-08-27 1976-03-02 Fujitsu Ltd Purintohaisenbanno metsukihoho
JPS5372167A (en) * 1976-12-09 1978-06-27 Fujitsu Ltd Method of plating electrolytic through hole of printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5125772A (en) * 1974-08-27 1976-03-02 Fujitsu Ltd Purintohaisenbanno metsukihoho
JPS5372167A (en) * 1976-12-09 1978-06-27 Fujitsu Ltd Method of plating electrolytic through hole of printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009287098A (en) * 2008-05-30 2009-12-10 I Plant:Kk Plating apparatus
JP2010070779A (en) * 2008-09-16 2010-04-02 National Institute Of Advanced Industrial Science & Technology Defoaming device, bubble removing method, plating method and micro-metallic structure

Also Published As

Publication number Publication date
JPS5739079B2 (en) 1982-08-19

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