JPS55156342A - Resin sealed electronic parts - Google Patents

Resin sealed electronic parts

Info

Publication number
JPS55156342A
JPS55156342A JP6383579A JP6383579A JPS55156342A JP S55156342 A JPS55156342 A JP S55156342A JP 6383579 A JP6383579 A JP 6383579A JP 6383579 A JP6383579 A JP 6383579A JP S55156342 A JPS55156342 A JP S55156342A
Authority
JP
Japan
Prior art keywords
electrolytes
electronic parts
content
polyphenylene sulfide
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6383579A
Other languages
Japanese (ja)
Inventor
Takae Ikeda
Masashi Shidara
Takashi Yokoyama
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6383579A priority Critical patent/JPS55156342A/en
Publication of JPS55156342A publication Critical patent/JPS55156342A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)

Abstract

PURPOSE:To obtain sealed electronic parts highly stable under high pressure vapor, by using a polyphenylene sulfide resin with a water soluble electrolyte content of 100ppm or less in sealing the electronic parts. CONSTITUTION:It is common that a thermoplastic resin consists of polyphenylene sulfide contains considerable electrolytes. Therefore, the content of the electrolytes. Therefore, the content of the electrolytes is reduced to 100ppm or less after washing by demineralized water, as the thermoplastic resin cannot be used in an original condition. The warm of demineralized water effects the reduction of an electrolyte content. Therefore, boiling water or pressure hot water is used. If polyphenylene sulfide is left in a powder condition of 100 mesh or less, a contact area to the demineralized water will be increased and the effect of eliminating electrolytes will further be increased. This method reduces the content of electrolytes and the coating and sealing is applied to electronic parts by using such a resin.
JP6383579A 1979-05-25 1979-05-25 Resin sealed electronic parts Pending JPS55156342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6383579A JPS55156342A (en) 1979-05-25 1979-05-25 Resin sealed electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6383579A JPS55156342A (en) 1979-05-25 1979-05-25 Resin sealed electronic parts

Publications (1)

Publication Number Publication Date
JPS55156342A true JPS55156342A (en) 1980-12-05

Family

ID=13240795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6383579A Pending JPS55156342A (en) 1979-05-25 1979-05-25 Resin sealed electronic parts

Country Status (1)

Country Link
JP (1) JPS55156342A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5949233A (en) * 1982-09-10 1984-03-21 フイリツプス・ペトロリユ−ム・コンパニ− Extraction of impuritires from arylene sulfide polymer
US4507468A (en) * 1982-07-16 1985-03-26 Dainippon Ink And Chemicals, Inc. Method for purifying polyphenylene sulfide
JPS61220445A (en) * 1985-03-27 1986-09-30 Toray Ind Inc Resin-sealed electronic components
JPS62150752A (en) * 1985-12-25 1987-07-04 Toray Ind Inc Resin-sealed electronic parts
JPS62153345A (en) * 1985-12-27 1987-07-08 Toray Ind Inc Polyphenylene sulfide resin composition
JPS6436031A (en) * 1987-07-31 1989-02-07 Toshiba Corp Semiconductor device and manufacture thereof
US4814430A (en) * 1986-04-28 1989-03-21 Kureha Kagaku Kogyo Kabushiki Kaisha Process for producing poly(arylene sulfide) of reduced alkali metal content
JPH04236264A (en) * 1991-01-16 1992-08-25 Toray Ind Inc Polyphenylene sulfide resin composition
US5625002A (en) * 1988-06-02 1997-04-29 Toray Industries, Inc. Polyphenylene sulfide composition and shaped articles made therefrom
WO2010010760A1 (en) 2008-07-22 2010-01-28 株式会社クレハ Process for production of polyarylene sulfide having reduced terminal halogen group content
CN101585988B (en) 2008-05-22 2011-01-12 徐芗明 A kind of high temperature resistant coating and preparation method thereof
KR20190095102A (en) 2016-12-30 2019-08-14 저지앙 엔에이치유 스페셜 머티어리얼스 컴퍼니 리미티드 Low chlorine polyphenylene sulfides and methods for their preparation, resin compositions and shaped bodies
CN111286027A (en) * 2020-02-13 2020-06-16 四川明道和化学新材料有限公司 Production method of polyphenylene sulfide with low covalent bonding chlorine

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507468A (en) * 1982-07-16 1985-03-26 Dainippon Ink And Chemicals, Inc. Method for purifying polyphenylene sulfide
JPS5949233A (en) * 1982-09-10 1984-03-21 フイリツプス・ペトロリユ−ム・コンパニ− Extraction of impuritires from arylene sulfide polymer
JPS61220445A (en) * 1985-03-27 1986-09-30 Toray Ind Inc Resin-sealed electronic components
JPS62150752A (en) * 1985-12-25 1987-07-04 Toray Ind Inc Resin-sealed electronic parts
JPS62153345A (en) * 1985-12-27 1987-07-08 Toray Ind Inc Polyphenylene sulfide resin composition
US4814430A (en) * 1986-04-28 1989-03-21 Kureha Kagaku Kogyo Kabushiki Kaisha Process for producing poly(arylene sulfide) of reduced alkali metal content
JPS6436031A (en) * 1987-07-31 1989-02-07 Toshiba Corp Semiconductor device and manufacture thereof
US5625002A (en) * 1988-06-02 1997-04-29 Toray Industries, Inc. Polyphenylene sulfide composition and shaped articles made therefrom
US5654358A (en) * 1988-06-02 1997-08-05 Toray Industries, Inc. Polyphenylene sulfide composition and shaped articles made therefrom
JPH04236264A (en) * 1991-01-16 1992-08-25 Toray Ind Inc Polyphenylene sulfide resin composition
CN101585988B (en) 2008-05-22 2011-01-12 徐芗明 A kind of high temperature resistant coating and preparation method thereof
WO2010010760A1 (en) 2008-07-22 2010-01-28 株式会社クレハ Process for production of polyarylene sulfide having reduced terminal halogen group content
US8680230B2 (en) 2008-07-22 2014-03-25 Kureha Corporation Production process of poly(arylene sulfide) whose content of terminal halogen group has been reduced
KR20190095102A (en) 2016-12-30 2019-08-14 저지앙 엔에이치유 스페셜 머티어리얼스 컴퍼니 리미티드 Low chlorine polyphenylene sulfides and methods for their preparation, resin compositions and shaped bodies
CN111286027A (en) * 2020-02-13 2020-06-16 四川明道和化学新材料有限公司 Production method of polyphenylene sulfide with low covalent bonding chlorine
CN111286027B (en) * 2020-02-13 2022-06-10 四川明道和化学新材料有限公司 Production method of polyphenylene sulfide with low covalent bonding chlorine

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