JPS55165653A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55165653A
JPS55165653A JP7411479A JP7411479A JPS55165653A JP S55165653 A JPS55165653 A JP S55165653A JP 7411479 A JP7411479 A JP 7411479A JP 7411479 A JP7411479 A JP 7411479A JP S55165653 A JPS55165653 A JP S55165653A
Authority
JP
Japan
Prior art keywords
recess
ring
metalized
electrodes
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7411479A
Other languages
Japanese (ja)
Other versions
JPS6214096B2 (en
Inventor
Kazuo Iwase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7411479A priority Critical patent/JPS55165653A/en
Publication of JPS55165653A publication Critical patent/JPS55165653A/en
Publication of JPS6214096B2 publication Critical patent/JPS6214096B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent snapping and enhance production yield, by providing a recess on one of the end faces of a dielectric ring whereon a lid is brazed and by connecting a semiconductor chip to metalized electrodes provided on the recess. CONSTITUTION:A diode chip 10 is mounted on a pedestal 40 and surrounded by a dielectric ring 20 and a lid 60. The bottom of the ring 20 is bonded to the pedestal by metalized electrodes 80. Other metalized electrodes 30 are provided on the top of the ring. The lid 60 is brazed at 70 on the metalized electrode 30. An annular recess is provided on the inner part of the top of the ring 20. The metalized electrodes 30 are located on the recess. Lead wires 50 from the chip 10 are connected to the electrodes 30 in the recess 30'. Since the lead wires 50 are separated from a brazing material 70 by a height difference, the lead wires do not melt into the brazing material and are not broken.
JP7411479A 1979-06-12 1979-06-12 Semiconductor device Granted JPS55165653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7411479A JPS55165653A (en) 1979-06-12 1979-06-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7411479A JPS55165653A (en) 1979-06-12 1979-06-12 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55165653A true JPS55165653A (en) 1980-12-24
JPS6214096B2 JPS6214096B2 (en) 1987-03-31

Family

ID=13537844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7411479A Granted JPS55165653A (en) 1979-06-12 1979-06-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55165653A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849443U (en) * 1981-09-26 1983-04-04 三菱電機株式会社 Packages for semiconductor devices
JPH03119227A (en) * 1989-09-30 1991-05-21 Iseki & Co Ltd Locking device of hydraulic operation lever in extremely small shovelcar

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278683A (en) * 1988-04-28 1989-11-09 Yoshihiro Yonahara Ladder

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4925822U (en) * 1972-06-08 1974-03-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4925822U (en) * 1972-06-08 1974-03-05

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849443U (en) * 1981-09-26 1983-04-04 三菱電機株式会社 Packages for semiconductor devices
JPH03119227A (en) * 1989-09-30 1991-05-21 Iseki & Co Ltd Locking device of hydraulic operation lever in extremely small shovelcar

Also Published As

Publication number Publication date
JPS6214096B2 (en) 1987-03-31

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