JPS55169875U - - Google Patents
Info
- Publication number
- JPS55169875U JPS55169875U JP1979069063U JP6906379U JPS55169875U JP S55169875 U JPS55169875 U JP S55169875U JP 1979069063 U JP1979069063 U JP 1979069063U JP 6906379 U JP6906379 U JP 6906379U JP S55169875 U JPS55169875 U JP S55169875U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979069063U JPS5911457Y2 (ja) | 1979-05-23 | 1979-05-23 | 光結合半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979069063U JPS5911457Y2 (ja) | 1979-05-23 | 1979-05-23 | 光結合半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55169875U true JPS55169875U (2) | 1980-12-05 |
| JPS5911457Y2 JPS5911457Y2 (ja) | 1984-04-09 |
Family
ID=29302896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979069063U Expired JPS5911457Y2 (ja) | 1979-05-23 | 1979-05-23 | 光結合半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5911457Y2 (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023189918A1 (ja) * | 2022-04-01 | 2023-10-05 | パナソニックＩｐマネジメント株式会社 | 半導体リレー及びそれを備えた半導体リレーモジュール |
-
1979
- 1979-05-23 JP JP1979069063U patent/JPS5911457Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023189918A1 (ja) * | 2022-04-01 | 2023-10-05 | パナソニックＩｐマネジメント株式会社 | 半導体リレー及びそれを備えた半導体リレーモジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5911457Y2 (ja) | 1984-04-09 |