JPS5523181A - Adhesive sheet - Google Patents

Adhesive sheet

Info

Publication number
JPS5523181A
JPS5523181A JP8172179A JP8172179A JPS5523181A JP S5523181 A JPS5523181 A JP S5523181A JP 8172179 A JP8172179 A JP 8172179A JP 8172179 A JP8172179 A JP 8172179A JP S5523181 A JPS5523181 A JP S5523181A
Authority
JP
Japan
Prior art keywords
sheet
epoxy resin
adhesive
adherends
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8172179A
Other languages
Japanese (ja)
Inventor
Akira Kazami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP8172179A priority Critical patent/JPS5523181A/en
Publication of JPS5523181A publication Critical patent/JPS5523181A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)

Abstract

PURPOSE: To manufacture an adhesive sheet useful for the uniform bonding and sealing of a hybrid IC without using a coating process, by impregnating a nonwoven sheet with a liquid epoxy resin, and solidifying the epoxy resin.
CONSTITUTION: A non-woven fabric sheet 11 of about 150μ thickness made of paper or synthetic fiber such as polyester, is impregnated with a liquid epoxy resin 12 as an adhesive resin. The impregnated sheet is solidified by evaporating the solvent of the adhesive resin 12, and punched out to a desired shape. The punched piece of the sheet is inserted between adherends, and hot-pressed to effect the bonding and sealing of the adherends.
COPYRIGHT: (C)1980,JPO&Japio
JP8172179A 1979-06-27 1979-06-27 Adhesive sheet Pending JPS5523181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8172179A JPS5523181A (en) 1979-06-27 1979-06-27 Adhesive sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8172179A JPS5523181A (en) 1979-06-27 1979-06-27 Adhesive sheet

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12737572A Division JPS4982968A (en) 1972-12-18 1972-12-18

Publications (1)

Publication Number Publication Date
JPS5523181A true JPS5523181A (en) 1980-02-19

Family

ID=13754272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8172179A Pending JPS5523181A (en) 1979-06-27 1979-06-27 Adhesive sheet

Country Status (1)

Country Link
JP (1) JPS5523181A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01122049U (en) * 1988-02-10 1989-08-18
JPH0286675A (en) * 1988-09-22 1990-03-27 Nitto Denko Corp Fixing material for printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01122049U (en) * 1988-02-10 1989-08-18
JPH0286675A (en) * 1988-09-22 1990-03-27 Nitto Denko Corp Fixing material for printed circuit board

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