JPS5524404A - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device

Info

Publication number
JPS5524404A
JPS5524404A JP9610178A JP9610178A JPS5524404A JP S5524404 A JPS5524404 A JP S5524404A JP 9610178 A JP9610178 A JP 9610178A JP 9610178 A JP9610178 A JP 9610178A JP S5524404 A JPS5524404 A JP S5524404A
Authority
JP
Japan
Prior art keywords
led
dent
lead frame
light guide
coupling efficiency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9610178A
Other languages
Japanese (ja)
Inventor
Tetsuo Sadamasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9610178A priority Critical patent/JPS5524404A/en
Publication of JPS5524404A publication Critical patent/JPS5524404A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: To transmit light at high coupling efficiency by configuring a system so as to radiate the light in one direction and constituting a concave lens with insulating resin near the tip of a light guide.
CONSTITUTION: LED 1 is sticked on a lead frame 21 with a conductive epoxy 3 with n type GaP coming lower. There is provided beforehand a reflection plate 4 around the portion sticked. Next, LED and the other terminal 22 of lead frame are subjected to connection 5. Then, a die is filled up with a transparent epoxy resin, the lead frame is soaked to harden the resin 6 through heat treatment, and the bottom 8 of a dent 7 formed then is positioned near LED 1. After a light guide 9 is inserted in the dent, a transparent bonding agent 10 is used to fix it, and LED and the light guide are coupled optically. The nearer is the dent bottom to LED, the better is coupling efficiency improved, thus ensuring a high coupling efficiency accurate and steady in construction.
COPYRIGHT: (C)1980,JPO&Japio
JP9610178A 1978-08-09 1978-08-09 Semiconductor light emitting device Pending JPS5524404A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9610178A JPS5524404A (en) 1978-08-09 1978-08-09 Semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9610178A JPS5524404A (en) 1978-08-09 1978-08-09 Semiconductor light emitting device

Publications (1)

Publication Number Publication Date
JPS5524404A true JPS5524404A (en) 1980-02-21

Family

ID=14155989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9610178A Pending JPS5524404A (en) 1978-08-09 1978-08-09 Semiconductor light emitting device

Country Status (1)

Country Link
JP (1) JPS5524404A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243811A (en) * 1975-10-03 1977-04-06 Nippon Kogen Concrete Concrete mold of boxxform section
JPS587365U (en) * 1981-07-07 1983-01-18 スタンレー電気株式会社 Light condensing device for light emitting diodes for optical communication
JPS58204576A (en) * 1982-05-24 1983-11-29 Mitsubishi Rayon Co Ltd Semiconductor light emitting element and photodetector
JPS594514U (en) * 1982-07-01 1984-01-12 オムロン株式会社 fiber optic equipment
JPS59141314U (en) * 1983-03-14 1984-09-21 ロ−ム株式会社 light emitting diode device
JPS6129501A (en) * 1984-07-19 1986-02-10 積水プラントシステム株式会社 Manufacture of unit body for constituting cellar
JPS61108180A (en) * 1984-10-31 1986-05-26 Tatsuta Electric Wire & Cable Co Ltd Photoelectric conversion element
JPS62113308U (en) * 1986-12-26 1987-07-18
JPS6446335U (en) * 1987-09-18 1989-03-22
JPH0218057U (en) * 1988-07-15 1990-02-06
JP2009128430A (en) * 2007-11-20 2009-06-11 Nitto Denko Corp Optical waveguide device manufacturing method, optical waveguide device obtained thereby, and optical waveguide connection structure used therefor
WO2010113911A1 (en) * 2009-03-30 2010-10-07 株式会社オートネットワーク技術研究所 Optical communication module and manufacturing method therefor
WO2010113910A1 (en) * 2009-03-30 2010-10-07 株式会社オートネットワーク技術研究所 Optical communication module and manufacturing method therefor

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243811A (en) * 1975-10-03 1977-04-06 Nippon Kogen Concrete Concrete mold of boxxform section
JPS587365U (en) * 1981-07-07 1983-01-18 スタンレー電気株式会社 Light condensing device for light emitting diodes for optical communication
JPS58204576A (en) * 1982-05-24 1983-11-29 Mitsubishi Rayon Co Ltd Semiconductor light emitting element and photodetector
JPS594514U (en) * 1982-07-01 1984-01-12 オムロン株式会社 fiber optic equipment
JPS59141314U (en) * 1983-03-14 1984-09-21 ロ−ム株式会社 light emitting diode device
JPS6129501A (en) * 1984-07-19 1986-02-10 積水プラントシステム株式会社 Manufacture of unit body for constituting cellar
JPS61108180A (en) * 1984-10-31 1986-05-26 Tatsuta Electric Wire & Cable Co Ltd Photoelectric conversion element
JPS62113308U (en) * 1986-12-26 1987-07-18
JPS6446335U (en) * 1987-09-18 1989-03-22
JPH0218057U (en) * 1988-07-15 1990-02-06
JP2009128430A (en) * 2007-11-20 2009-06-11 Nitto Denko Corp Optical waveguide device manufacturing method, optical waveguide device obtained thereby, and optical waveguide connection structure used therefor
US7906355B2 (en) 2007-11-20 2011-03-15 Nitto Denko Corporation Optical waveguide device production method, optical waveguide device produced by the method, and optical waveguide connection structure to be used for the device
KR101510895B1 (en) * 2007-11-20 2015-04-10 닛토덴코 가부시키가이샤 A method of manufacturing an optical waveguide device and an optical waveguide device obtained thereby, and an optical waveguide connection structure
WO2010113911A1 (en) * 2009-03-30 2010-10-07 株式会社オートネットワーク技術研究所 Optical communication module and manufacturing method therefor
WO2010113910A1 (en) * 2009-03-30 2010-10-07 株式会社オートネットワーク技術研究所 Optical communication module and manufacturing method therefor
JP5338900B2 (en) * 2009-03-30 2013-11-13 株式会社オートネットワーク技術研究所 Optical communication module and method for manufacturing optical communication module
JP5338899B2 (en) * 2009-03-30 2013-11-13 株式会社オートネットワーク技術研究所 Optical communication module and method for manufacturing optical communication module

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