JPS5529128A - Method of surface treating printed circuit copper foil - Google Patents

Method of surface treating printed circuit copper foil

Info

Publication number
JPS5529128A
JPS5529128A JP10187578A JP10187578A JPS5529128A JP S5529128 A JPS5529128 A JP S5529128A JP 10187578 A JP10187578 A JP 10187578A JP 10187578 A JP10187578 A JP 10187578A JP S5529128 A JPS5529128 A JP S5529128A
Authority
JP
Japan
Prior art keywords
printed circuit
copper foil
surface treating
circuit copper
treating printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10187578A
Other languages
Japanese (ja)
Inventor
Masato Ishii
Kouji Himuro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP10187578A priority Critical patent/JPS5529128A/en
Publication of JPS5529128A publication Critical patent/JPS5529128A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP10187578A 1978-08-23 1978-08-23 Method of surface treating printed circuit copper foil Pending JPS5529128A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10187578A JPS5529128A (en) 1978-08-23 1978-08-23 Method of surface treating printed circuit copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10187578A JPS5529128A (en) 1978-08-23 1978-08-23 Method of surface treating printed circuit copper foil

Publications (1)

Publication Number Publication Date
JPS5529128A true JPS5529128A (en) 1980-03-01

Family

ID=14312136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10187578A Pending JPS5529128A (en) 1978-08-23 1978-08-23 Method of surface treating printed circuit copper foil

Country Status (1)

Country Link
JP (1) JPS5529128A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981560A (en) * 1988-03-25 1991-01-01 Fukuda Metal Foil & Powder Industrial Co., Ltd. Method of surface treatment of copper foil or a copper clad laminate for internal layer
JPH03503185A (en) * 1988-01-29 1991-07-18 プロイサク　シュタール　アクチエンゲゼルシャフト Method for manufacturing cold rolled thin plate or strip
CN100572608C (en) 2005-04-15 2009-12-23 福田金属箔粉工业株式会社 Copper foil roughening treatment method and roughening treatment liquid
CN103866366A (en) * 2014-03-13 2014-06-18 江苏铭丰电子材料科技有限公司 Composite plating treatment process of electrolytic copper foil copper-based high polymer material

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5219125A (en) * 1975-08-07 1977-02-14 Nippon Mining Co Method of treating surface of copper foils

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5219125A (en) * 1975-08-07 1977-02-14 Nippon Mining Co Method of treating surface of copper foils

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03503185A (en) * 1988-01-29 1991-07-18 プロイサク　シュタール　アクチエンゲゼルシャフト Method for manufacturing cold rolled thin plate or strip
US4981560A (en) * 1988-03-25 1991-01-01 Fukuda Metal Foil & Powder Industrial Co., Ltd. Method of surface treatment of copper foil or a copper clad laminate for internal layer
CN100572608C (en) 2005-04-15 2009-12-23 福田金属箔粉工业株式会社 Copper foil roughening treatment method and roughening treatment liquid
CN103866366A (en) * 2014-03-13 2014-06-18 江苏铭丰电子材料科技有限公司 Composite plating treatment process of electrolytic copper foil copper-based high polymer material

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