JPS5531812A - Bonding of bulky thermal insulation board to hard base - Google Patents
Bonding of bulky thermal insulation board to hard baseInfo
- Publication number
- JPS5531812A JPS5531812A JP10345778A JP10345778A JPS5531812A JP S5531812 A JPS5531812 A JP S5531812A JP 10345778 A JP10345778 A JP 10345778A JP 10345778 A JP10345778 A JP 10345778A JP S5531812 A JPS5531812 A JP S5531812A
- Authority
- JP
- Japan
- Prior art keywords
- thermal insulation
- bonding
- insulation board
- board
- bulky thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009413 insulation Methods 0.000 title abstract 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000002131 composite material Substances 0.000 abstract 2
- 230000000694 effects Effects 0.000 abstract 2
- 239000004604 Blowing Agent Substances 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 238000004049 embossing Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000011490 mineral wool Substances 0.000 abstract 1
- 229920002635 polyurethane Polymers 0.000 abstract 1
- 239000004814 polyurethane Substances 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 abstract 1
- 229940029284 trichlorofluoromethane Drugs 0.000 abstract 1
Landscapes
- Building Environments (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10345778A JPS5531812A (en) | 1978-08-24 | 1978-08-24 | Bonding of bulky thermal insulation board to hard base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10345778A JPS5531812A (en) | 1978-08-24 | 1978-08-24 | Bonding of bulky thermal insulation board to hard base |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5531812A true JPS5531812A (en) | 1980-03-06 |
| JPS6246345B2 JPS6246345B2 (da) | 1987-10-01 |
Family
ID=14354546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10345778A Granted JPS5531812A (en) | 1978-08-24 | 1978-08-24 | Bonding of bulky thermal insulation board to hard base |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5531812A (da) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040009456A (ko) * | 2002-07-23 | 2004-01-31 | 아진테크주식회사 | 건축물 외장용 샌드위치 복합 판넬 |
-
1978
- 1978-08-24 JP JP10345778A patent/JPS5531812A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040009456A (ko) * | 2002-07-23 | 2004-01-31 | 아진테크주식회사 | 건축물 외장용 샌드위치 복합 판넬 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6246345B2 (da) | 1987-10-01 |
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