JPS5533063A - Method of manufacturing high packing density mounted substrate - Google Patents

Method of manufacturing high packing density mounted substrate

Info

Publication number
JPS5533063A
JPS5533063A JP10584578A JP10584578A JPS5533063A JP S5533063 A JPS5533063 A JP S5533063A JP 10584578 A JP10584578 A JP 10584578A JP 10584578 A JP10584578 A JP 10584578A JP S5533063 A JPS5533063 A JP S5533063A
Authority
JP
Japan
Prior art keywords
packing density
manufacturing high
high packing
mounted substrate
density mounted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10584578A
Other languages
Japanese (ja)
Other versions
JPS6231515B2 (en
Inventor
Katsuhiko Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP10584578A priority Critical patent/JPS5533063A/en
Publication of JPS5533063A publication Critical patent/JPS5533063A/en
Publication of JPS6231515B2 publication Critical patent/JPS6231515B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP10584578A 1978-08-29 1978-08-29 Method of manufacturing high packing density mounted substrate Granted JPS5533063A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10584578A JPS5533063A (en) 1978-08-29 1978-08-29 Method of manufacturing high packing density mounted substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10584578A JPS5533063A (en) 1978-08-29 1978-08-29 Method of manufacturing high packing density mounted substrate

Publications (2)

Publication Number Publication Date
JPS5533063A true JPS5533063A (en) 1980-03-08
JPS6231515B2 JPS6231515B2 (en) 1987-07-08

Family

ID=14418345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10584578A Granted JPS5533063A (en) 1978-08-29 1978-08-29 Method of manufacturing high packing density mounted substrate

Country Status (1)

Country Link
JP (1) JPS5533063A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60252374A (en) * 1984-05-29 1985-12-13 Matsushita Electric Ind Co Ltd Color image forming method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5297166A (en) * 1976-02-10 1977-08-15 Nippon Electric Co Method of producing thick multilayer circuit substrate
JPS5365970A (en) * 1976-11-26 1978-06-12 Tokyo Shibaura Electric Co Method of producing thick film circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5297166A (en) * 1976-02-10 1977-08-15 Nippon Electric Co Method of producing thick multilayer circuit substrate
JPS5365970A (en) * 1976-11-26 1978-06-12 Tokyo Shibaura Electric Co Method of producing thick film circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60252374A (en) * 1984-05-29 1985-12-13 Matsushita Electric Ind Co Ltd Color image forming method

Also Published As

Publication number Publication date
JPS6231515B2 (en) 1987-07-08

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