JPS5533651Y2 - - Google Patents
Info
- Publication number
- JPS5533651Y2 JPS5533651Y2 JP1975083064U JP8306475U JPS5533651Y2 JP S5533651 Y2 JPS5533651 Y2 JP S5533651Y2 JP 1975083064 U JP1975083064 U JP 1975083064U JP 8306475 U JP8306475 U JP 8306475U JP S5533651 Y2 JPS5533651 Y2 JP S5533651Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975083064U JPS5533651Y2 (cs) | 1975-06-17 | 1975-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975083064U JPS5533651Y2 (cs) | 1975-06-17 | 1975-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51162664U JPS51162664U (cs) | 1976-12-24 |
| JPS5533651Y2 true JPS5533651Y2 (cs) | 1980-08-09 |
Family
ID=28564093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975083064U Expired JPS5533651Y2 (cs) | 1975-06-17 | 1975-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5533651Y2 (cs) |
-
1975
- 1975-06-17 JP JP1975083064U patent/JPS5533651Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51162664U (cs) | 1976-12-24 |