JPS5534426A - Wafer dicing device - Google Patents

Wafer dicing device

Info

Publication number
JPS5534426A
JPS5534426A JP10641578A JP10641578A JPS5534426A JP S5534426 A JPS5534426 A JP S5534426A JP 10641578 A JP10641578 A JP 10641578A JP 10641578 A JP10641578 A JP 10641578A JP S5534426 A JPS5534426 A JP S5534426A
Authority
JP
Japan
Prior art keywords
blade
driven
dicing
wafer
spindle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10641578A
Other languages
Japanese (ja)
Inventor
Mitsuo Sumiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10641578A priority Critical patent/JPS5534426A/en
Publication of JPS5534426A publication Critical patent/JPS5534426A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02B—INTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENGINES IN GENERAL
    • F02B75/00—Other engines
    • F02B75/02—Engines characterised by their cycles, e.g. six-stroke
    • F02B2075/022—Engines characterised by their cycles, e.g. six-stroke having less than six strokes per cycle
    • F02B2075/025—Engines characterised by their cycles, e.g. six-stroke having less than six strokes per cycle two

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To provide the subject device wherein various steps relative to dicing are carried out in parallel by driving a blade but without driving wafers.
CONSTITUTION: A spindle 32 of a dicing device 20, which spindle is provided with a blade 34 is rotatably supported by a bearing unit 31 provided rotatably, said bearing unit 31 being provided on a plane in a movable manner through a first table 26 and a second table 27 which are movable in the intersecting direction. In this device wafers 12 which have been carried by, for example, a turntable 2 are located by a locating mechanism 36, and thereafter the blade 34 is driven and at the same time, the first table 26 is driven in a reciprocating manner, a second table 27 being advanced and driven in the interval of the cutting line at each 1/2 stroke of said first table, and then the wafer 12 is rotated by 90 degrees to backward1y drive the blade 34 thereby to subject the wafer to dicing.
COPYRIGHT: (C)1980,JPO&Japio
JP10641578A 1978-08-31 1978-08-31 Wafer dicing device Pending JPS5534426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10641578A JPS5534426A (en) 1978-08-31 1978-08-31 Wafer dicing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10641578A JPS5534426A (en) 1978-08-31 1978-08-31 Wafer dicing device

Publications (1)

Publication Number Publication Date
JPS5534426A true JPS5534426A (en) 1980-03-11

Family

ID=14433028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10641578A Pending JPS5534426A (en) 1978-08-31 1978-08-31 Wafer dicing device

Country Status (1)

Country Link
JP (1) JPS5534426A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0191509U (en) * 1987-12-11 1989-06-15

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0191509U (en) * 1987-12-11 1989-06-15

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