JPS553470A - Method and apparatus for pressing bonded surface - Google Patents
Method and apparatus for pressing bonded surfaceInfo
- Publication number
- JPS553470A JPS553470A JP7715978A JP7715978A JPS553470A JP S553470 A JPS553470 A JP S553470A JP 7715978 A JP7715978 A JP 7715978A JP 7715978 A JP7715978 A JP 7715978A JP S553470 A JPS553470 A JP S553470A
- Authority
- JP
- Japan
- Prior art keywords
- platen
- suction holes
- bonded
- adhesive
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- 239000012790 adhesive layer Substances 0.000 abstract 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To apply uniform pressure to bonded surfaces, and to save labor in the pressing operation, by placing adherands bonded with an adhesive on a platen having a number of suction holes, covering the adherands with an elastic sheet, and evacuating the space between the sheet and the platen through the suction holes.
CONSTITUTION: Aggregate (a) is bonded to a decorative laminate (b) with an adhesive 8, and placed on a platen 2 having a number of suction holes 1, 1,.... The decorative laminate, etc. and the suction holes are covered with an elastic sheet 3. Air between the sheet and the platen, and air in a suction chamber 4, are sucked with an evacuation means 6 such as vacuum pump. The bonded surface is pressed with atmospheric pressure until the adhesive 8 is cured. Bubbles existing in the adhesive layer are also eliminated, and the complete adhesion can be attained.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7715978A JPS553470A (en) | 1978-06-26 | 1978-06-26 | Method and apparatus for pressing bonded surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7715978A JPS553470A (en) | 1978-06-26 | 1978-06-26 | Method and apparatus for pressing bonded surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS553470A true JPS553470A (en) | 1980-01-11 |
Family
ID=13626005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7715978A Pending JPS553470A (en) | 1978-06-26 | 1978-06-26 | Method and apparatus for pressing bonded surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS553470A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0374929U (en) * | 1989-11-22 | 1991-07-26 |
-
1978
- 1978-06-26 JP JP7715978A patent/JPS553470A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0374929U (en) * | 1989-11-22 | 1991-07-26 |
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