JPS5538018A - Multi-layer wiring structure - Google Patents

Multi-layer wiring structure

Info

Publication number
JPS5538018A
JPS5538018A JP11050578A JP11050578A JPS5538018A JP S5538018 A JPS5538018 A JP S5538018A JP 11050578 A JP11050578 A JP 11050578A JP 11050578 A JP11050578 A JP 11050578A JP S5538018 A JPS5538018 A JP S5538018A
Authority
JP
Japan
Prior art keywords
wiring layers
windows
opened
wiring
cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11050578A
Other languages
Japanese (ja)
Inventor
Kazunari Shirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11050578A priority Critical patent/JPS5538018A/en
Publication of JPS5538018A publication Critical patent/JPS5538018A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To obtain a non-through-hole-required simple wiring structure by inserting an insulation layer between wiring layers of the sections, in which wiring layers are electrically separated (or isolated) and cross each other, and also by piling wiring layers on the section where the wiring layers are electrically connected and cross each other.
CONSTITUTION: Electrode windows 22 and 23 are opened on a thermal oxidation film 21 on a semiconductor base plate 20, an entire surface is covered with a PSG film 24, the windows are again opened on thus prepared surface and No.1 wiring layers 25 and 26 are formed using aluminum. And then, a negative type photoresist 27 is attached, windows A and B are opened by light-exposing development on the section where wiring layers of No.1 layer and No.2 layer cross each other without being connected to each other, a polyamide film 30 is formed and the polyamide film 30' is made to remain only on sections A and B by lift-off process. And then a positive type photoresist is coated on the base plate, windows are opened on the No.2 wiring region, aluminum is soldered and No.2 wiring layers 28 and 29 are formed by lift-off process.
COPYRIGHT: (C)1980,JPO&Japio
JP11050578A 1978-09-08 1978-09-08 Multi-layer wiring structure Pending JPS5538018A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11050578A JPS5538018A (en) 1978-09-08 1978-09-08 Multi-layer wiring structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11050578A JPS5538018A (en) 1978-09-08 1978-09-08 Multi-layer wiring structure

Publications (1)

Publication Number Publication Date
JPS5538018A true JPS5538018A (en) 1980-03-17

Family

ID=14537464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11050578A Pending JPS5538018A (en) 1978-09-08 1978-09-08 Multi-layer wiring structure

Country Status (1)

Country Link
JP (1) JPS5538018A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6118300U (en) * 1984-07-06 1986-02-01 杉安工業株式会社 Automobile maintenance lift safety device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6118300U (en) * 1984-07-06 1986-02-01 杉安工業株式会社 Automobile maintenance lift safety device

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