JPS5541734A - Boiling water cooling-type semiconductor stack - Google Patents
Boiling water cooling-type semiconductor stackInfo
- Publication number
- JPS5541734A JPS5541734A JP11450578A JP11450578A JPS5541734A JP S5541734 A JPS5541734 A JP S5541734A JP 11450578 A JP11450578 A JP 11450578A JP 11450578 A JP11450578 A JP 11450578A JP S5541734 A JPS5541734 A JP S5541734A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- terminal plate
- source terminal
- gaps
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000009835 boiling Methods 0.000 title 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title 1
- 238000001816 cooling Methods 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To lessen thermal resistance, improve cooling capacity and to minimze the shape in the making of semiconductor stacks by providing a plurality of gaps in between each radiating plate and source terminal plate or between a semiconductor element and each source terminal plate.
CONSTITUTION: The present stack comprises a radiation plate 5 put in contact with each electrode 2 of a semiconductor element 1a, the radiating plate 5 being connected with a source terminal plate 6 by a plurality of pins 8 inbetween, the source terminal plate 6 being brought into contact with an insulating plate 7 to which pressure P is added to make such contact sufficiently close. In this arrangement, a plurality of gaps 9 are formed between the radiating plate and the terminal plate as separated by pins 8. The pins 8 are, in this sense, shaped like round bars and scattered all over the inner area and the circumferential area to thereby improve electric conductivity. Thermal generation is conveyed from a silicon joint 1 to the radiating plates 5 via the electrodes 2, and further from the gaps 9 into cooling media, not at all toward the circumferential area. Thus, thermal resistance can be lessend, so that the cooling capacity of the stack is improved.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11450578A JPS5541734A (en) | 1978-09-20 | 1978-09-20 | Boiling water cooling-type semiconductor stack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11450578A JPS5541734A (en) | 1978-09-20 | 1978-09-20 | Boiling water cooling-type semiconductor stack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5541734A true JPS5541734A (en) | 1980-03-24 |
Family
ID=14639426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11450578A Pending JPS5541734A (en) | 1978-09-20 | 1978-09-20 | Boiling water cooling-type semiconductor stack |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5541734A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3611811A1 (en) * | 1985-04-10 | 1986-10-16 | Hitachi, Ltd., Tokio/Tokyo | DEVICE FOR STEAM COOLING A SEMICONDUCTOR |
| JPS62175865U (en) * | 1986-04-25 | 1987-11-09 | ||
| WO2015010039A1 (en) * | 2013-07-19 | 2015-01-22 | General Electric Company | Method and system for an immersion boiling heat sink |
-
1978
- 1978-09-20 JP JP11450578A patent/JPS5541734A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3611811A1 (en) * | 1985-04-10 | 1986-10-16 | Hitachi, Ltd., Tokio/Tokyo | DEVICE FOR STEAM COOLING A SEMICONDUCTOR |
| US4694323A (en) * | 1985-04-10 | 1987-09-15 | Hitachi, Ltd. | Apparatus for vapor-cooling a semiconductor |
| JPS62175865U (en) * | 1986-04-25 | 1987-11-09 | ||
| WO2015010039A1 (en) * | 2013-07-19 | 2015-01-22 | General Electric Company | Method and system for an immersion boiling heat sink |
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