JPS5541780A - Tape carrying tape - Google Patents

Tape carrying tape

Info

Publication number
JPS5541780A
JPS5541780A JP11560578A JP11560578A JPS5541780A JP S5541780 A JPS5541780 A JP S5541780A JP 11560578 A JP11560578 A JP 11560578A JP 11560578 A JP11560578 A JP 11560578A JP S5541780 A JPS5541780 A JP S5541780A
Authority
JP
Japan
Prior art keywords
metal foil
hole
tape
film
opposing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11560578A
Other languages
Japanese (ja)
Other versions
JPS6054788B2 (en
Inventor
Tetsuo Yabushita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP53115605A priority Critical patent/JPS6054788B2/en
Publication of JPS5541780A publication Critical patent/JPS5541780A/en
Publication of JPS6054788B2 publication Critical patent/JPS6054788B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To laminate plastic films holding therebetween metal foils opposing to each other and each having a thickness of less than 125μm, to provide openings, and to insert a semiconductor element and a circuit constituting element therein and fill the same with a mold material thereby to increase the reliability of the tape.
CONSTITUTION: Plastic films each having a thickness of less than 125μm are laminated, and films 1 and 8 holding therebetween metal foils 2 forming lead fingers opposing to each other are bonded together by use of an epoxy bonding agent. Then, in the film 1 at the opposing parts of the metal foil 2 there is formed a hole 4 having a diameter slightly wider than that of a semiconductor element 3 to be inserted therein and there is formed a similar hole 11 in the film 8 thereby to expose the end part of the metal foil 2. Thereafter, the element 3 is inserted in the hole 4, and the electrode provided in said element 3 is connected to part of the metal foil 2, the holes 4 and 11 being filled with a mold material 6. Further, a parts- positioning hole 9 is opened on the film 8, and a circuit constituting element 10 is fixed thereto while bringing the same into contact with the metal foil 2.
COPYRIGHT: (C)1980,JPO&Japio
JP53115605A 1978-09-19 1978-09-19 Tape for tape carrier Expired JPS6054788B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53115605A JPS6054788B2 (en) 1978-09-19 1978-09-19 Tape for tape carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53115605A JPS6054788B2 (en) 1978-09-19 1978-09-19 Tape for tape carrier

Publications (2)

Publication Number Publication Date
JPS5541780A true JPS5541780A (en) 1980-03-24
JPS6054788B2 JPS6054788B2 (en) 1985-12-02

Family

ID=14666762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53115605A Expired JPS6054788B2 (en) 1978-09-19 1978-09-19 Tape for tape carrier

Country Status (1)

Country Link
JP (1) JPS6054788B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113173U (en) * 1988-01-26 1989-07-31

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52153478A (en) * 1976-06-15 1977-12-20 Matsushita Electric Ind Co Ltd Electronic watch
JPS532078A (en) * 1976-06-28 1978-01-10 Citizen Watch Co Ltd Sealing structure for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52153478A (en) * 1976-06-15 1977-12-20 Matsushita Electric Ind Co Ltd Electronic watch
JPS532078A (en) * 1976-06-28 1978-01-10 Citizen Watch Co Ltd Sealing structure for semiconductor device

Also Published As

Publication number Publication date
JPS6054788B2 (en) 1985-12-02

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