JPS5543202B2 - - Google Patents
Info
- Publication number
- JPS5543202B2 JPS5543202B2 JP6593472A JP6593472A JPS5543202B2 JP S5543202 B2 JPS5543202 B2 JP S5543202B2 JP 6593472 A JP6593472 A JP 6593472A JP 6593472 A JP6593472 A JP 6593472A JP S5543202 B2 JPS5543202 B2 JP S5543202B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Inorganic Insulating Materials (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6593472A JPS5543202B2 (en) | 1972-07-01 | 1972-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6593472A JPS5543202B2 (en) | 1972-07-01 | 1972-07-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4925499A JPS4925499A (en) | 1974-03-06 |
| JPS5543202B2 true JPS5543202B2 (en) | 1980-11-05 |
Family
ID=13301271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6593472A Expired JPS5543202B2 (en) | 1972-07-01 | 1972-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5543202B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5743491A (en) * | 1980-08-29 | 1982-03-11 | Toray Industries | Printed circuit board |
| JPS57135153A (en) * | 1981-02-14 | 1982-08-20 | Matsushita Electric Works Ltd | Method of bonding copper foil to shape |
| EP1768471B1 (en) | 2004-06-23 | 2013-05-29 | Hitachi Chemical Co., Ltd. | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| JP6275200B2 (en) * | 2016-06-16 | 2018-02-07 | 日本化薬株式会社 | Double-sided circuit board suitable for high-frequency circuits |
| JP6751910B2 (en) | 2016-10-05 | 2020-09-09 | パナソニックＩｐマネジメント株式会社 | Manufacturing method of multi-layer printed wiring board and multi-layer printed wiring board |
-
1972
- 1972-07-01 JP JP6593472A patent/JPS5543202B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4925499A (en) | 1974-03-06 |