JPS5543475A - Working method of parts of clock or wafer - Google Patents
Working method of parts of clock or waferInfo
- Publication number
- JPS5543475A JPS5543475A JP11766778A JP11766778A JPS5543475A JP S5543475 A JPS5543475 A JP S5543475A JP 11766778 A JP11766778 A JP 11766778A JP 11766778 A JP11766778 A JP 11766778A JP S5543475 A JPS5543475 A JP S5543475A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wax
- work
- impregnated
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 7
- 239000001993 wax Substances 0.000 abstract 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 2
- 230000008018 melting Effects 0.000 abstract 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 1
- 229920001800 Shellac Polymers 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000012188 paraffin wax Substances 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 230000002829 reductive effect Effects 0.000 abstract 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 abstract 1
- 229940113147 shellac Drugs 0.000 abstract 1
- 235000013874 shellac Nutrition 0.000 abstract 1
- 239000004208 shellac Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Clocks (AREA)
- Jigs For Machine Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE:To perform the high accurate lapping process and polishing process by making the wax impregnated porous substrate an adhesive substrate and thereby effectively securing the compact parts of the clocks and the electronic equipments. CONSTITUTION:To the metallic powder and the like such as Al2O3, SiO2, the binder such as Co, Ni are added and the obtained is molded, heated and sintered (about 850-1500 deg.C) under the reductive atmosphere, and the porous type sintered plate having porosity of about 40-65%, compression strength of about 100- 700kg/cm<2>. Then, the wax comprising mainly rosin, shellac, and paraffin and having the melting point of about 100 deg.C is impregnated under vacuum or forcibly impregnated under heating on the porous type sintered plate to form the connected substrate. Said substrate 1 has the surface which is wiped and cleaned by the solvent, and thereafter, the work 2 is mounted directly thereon and while applying pressure, the substrate 1 is heated higher than the melting point of the wax, and the wax floating up on the substrate surface 1 due to capillarity is employed for securing the work 2 to the substrate 1 effectively and giving work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11766778A JPS5543475A (en) | 1978-09-25 | 1978-09-25 | Working method of parts of clock or wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11766778A JPS5543475A (en) | 1978-09-25 | 1978-09-25 | Working method of parts of clock or wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5543475A true JPS5543475A (en) | 1980-03-27 |
| JPS6228434B2 JPS6228434B2 (en) | 1987-06-19 |
Family
ID=14717293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11766778A Granted JPS5543475A (en) | 1978-09-25 | 1978-09-25 | Working method of parts of clock or wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5543475A (en) |
-
1978
- 1978-09-25 JP JP11766778A patent/JPS5543475A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6228434B2 (en) | 1987-06-19 |
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