JPS5543899A - Device for tightening flat semiconductor element - Google Patents

Device for tightening flat semiconductor element

Info

Publication number
JPS5543899A
JPS5543899A JP12189379A JP12189379A JPS5543899A JP S5543899 A JPS5543899 A JP S5543899A JP 12189379 A JP12189379 A JP 12189379A JP 12189379 A JP12189379 A JP 12189379A JP S5543899 A JPS5543899 A JP S5543899A
Authority
JP
Japan
Prior art keywords
semiconductor element
flat semiconductor
tightening flat
tightening
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12189379A
Other languages
Japanese (ja)
Inventor
Burotsuku Harii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS5543899A publication Critical patent/JPS5543899A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Springs (AREA)
  • Die Bonding (AREA)
JP12189379A 1978-09-22 1979-09-21 Device for tightening flat semiconductor element Pending JPS5543899A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782841370 DE2841370A1 (en) 1978-09-22 1978-09-22 Clamping device for semiconductor chip - is pressed by set of cup springs with degressive characteristic, with each spring compressed to reach degressive area

Publications (1)

Publication Number Publication Date
JPS5543899A true JPS5543899A (en) 1980-03-27

Family

ID=6050202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12189379A Pending JPS5543899A (en) 1978-09-22 1979-09-21 Device for tightening flat semiconductor element

Country Status (2)

Country Link
JP (1) JPS5543899A (en)
DE (1) DE2841370A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646131A (en) * 1983-01-28 1987-02-24 Mitsubishi Denki Kabushiki Kaisha Rectifier device
DE4211426C1 (en) * 1992-04-01 1993-06-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De Clamping device securing gate-turn-off thyristor between opposing heat sinks - has threaded bolts between heat sinks and spring plate laminates activated in succession to exert pressure on pressure plate
FR2721438B1 (en) * 1994-06-21 1996-10-18 Jacques Daniel Lhomme Clamping device usable in particular for power semiconductors.
FR2729045B1 (en) * 1994-12-29 1997-01-24 Bull Sa METHOD AND DEVICE FOR FIXING TWO ELEMENTS SUCH AS AN INTEGRATED CIRCUIT RADIATOR IN A PRINTED CIRCUIT BOARD
US11776874B2 (en) 2020-03-24 2023-10-03 Solaredge Technologies Ltd. Apparatus and method for holding a heat generating device
DE102021214244A1 (en) 2021-12-13 2023-06-15 Robert Bosch Gesellschaft mit beschränkter Haftung Semiconductor assembly and method of manufacturing same

Also Published As

Publication number Publication date
DE2841370A1 (en) 1980-03-27

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