JPS5547469B2 - - Google Patents
Info
- Publication number
- JPS5547469B2 JPS5547469B2 JP11008773A JP11008773A JPS5547469B2 JP S5547469 B2 JPS5547469 B2 JP S5547469B2 JP 11008773 A JP11008773 A JP 11008773A JP 11008773 A JP11008773 A JP 11008773A JP S5547469 B2 JPS5547469 B2 JP S5547469B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07552—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in structures or sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/521—Structures or relative sizes of bond wires
- H10W72/527—Multiple bond wires having different sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes
Landscapes
- Thyristors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19722253489 DE2253489C3 (de) | 1972-10-31 | Thyristor und Verfahren zu seiner Herstellung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4978489A JPS4978489A (2) | 1974-07-29 |
| JPS5547469B2 true JPS5547469B2 (2) | 1980-11-29 |
Family
ID=5860568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11008773A Expired JPS5547469B2 (2) | 1972-10-31 | 1973-09-28 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5547469B2 (2) |
| BE (1) | BE806821A (2) |
| CH (1) | CH553480A (2) |
| FR (1) | FR2204895B1 (2) |
| IT (1) | IT998994B (2) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5756527Y2 (2) * | 1977-02-25 | 1982-12-04 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1095576A (2) * | 1964-08-12 | 1900-01-01 | ||
| DE1614410B2 (de) * | 1967-01-25 | 1973-12-13 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Halbleiterbauelement |
| US3538401A (en) * | 1968-04-11 | 1970-11-03 | Westinghouse Electric Corp | Drift field thyristor |
| FR2007870B1 (2) * | 1968-05-06 | 1975-01-10 | Rca Corp |
-
1973
- 1973-08-07 CH CH1139073A patent/CH553480A/xx not_active IP Right Cessation
- 1973-09-28 JP JP11008773A patent/JPS5547469B2/ja not_active Expired
- 1973-10-26 IT IT3061773A patent/IT998994B/it active
- 1973-10-30 FR FR7338611A patent/FR2204895B1/fr not_active Expired
- 1973-10-31 BE BE137328A patent/BE806821A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR2204895A1 (2) | 1974-05-24 |
| JPS4978489A (2) | 1974-07-29 |
| FR2204895B1 (2) | 1978-02-10 |
| IT998994B (it) | 1976-02-20 |
| CH553480A (de) | 1974-08-30 |
| BE806821A (fr) | 1974-02-15 |
| DE2253489A1 (de) | 1974-05-02 |
| DE2253489B2 (de) | 1977-04-28 |