JPS5550631A - Device for coupling adhered portions - Google Patents

Device for coupling adhered portions

Info

Publication number
JPS5550631A
JPS5550631A JP10033779A JP10033779A JPS5550631A JP S5550631 A JPS5550631 A JP S5550631A JP 10033779 A JP10033779 A JP 10033779A JP 10033779 A JP10033779 A JP 10033779A JP S5550631 A JPS5550631 A JP S5550631A
Authority
JP
Japan
Prior art keywords
coupling
adhered portions
adhered
portions
coupling adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10033779A
Other languages
English (en)
Japanese (ja)
Inventor
Banzemiru Manfureeto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elektromat VEB
Original Assignee
Elektromat VEB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elektromat VEB filed Critical Elektromat VEB
Publication of JPS5550631A publication Critical patent/JPS5550631A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP10033779A 1978-08-08 1979-08-08 Device for coupling adhered portions Pending JPS5550631A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD78207161A DD138121A1 (de) 1978-08-08 1978-08-08 Vorrichtung zum verbinden von kontaktstellen

Publications (1)

Publication Number Publication Date
JPS5550631A true JPS5550631A (en) 1980-04-12

Family

ID=5513935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10033779A Pending JPS5550631A (en) 1978-08-08 1979-08-08 Device for coupling adhered portions

Country Status (3)

Country Link
JP (1) JPS5550631A (de)
DD (1) DD138121A1 (de)
DE (1) DE2929042A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115430900A (zh) * 2022-09-02 2022-12-06 上饶市立景创新科技有限公司 一种金线焊接机

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0102728B1 (de) * 1982-07-27 1986-10-01 Luc Technologies Limited Feste Verbindung und damit hergestellte Erzeugnisse

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115430900A (zh) * 2022-09-02 2022-12-06 上饶市立景创新科技有限公司 一种金线焊接机
CN115430900B (zh) * 2022-09-02 2023-09-22 上饶市立景创新科技有限公司 一种金线焊接机

Also Published As

Publication number Publication date
DD138121A1 (de) 1979-10-10
DE2929042A1 (de) 1980-02-21

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