JPS555229A - Underlay for cuttinggoff - Google Patents

Underlay for cuttinggoff

Info

Publication number
JPS555229A
JPS555229A JP7501378A JP7501378A JPS555229A JP S555229 A JPS555229 A JP S555229A JP 7501378 A JP7501378 A JP 7501378A JP 7501378 A JP7501378 A JP 7501378A JP S555229 A JPS555229 A JP S555229A
Authority
JP
Japan
Prior art keywords
cuttinggoff
underlay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7501378A
Other languages
Japanese (ja)
Other versions
JPS5822235B2 (en
Inventor
Yasumasa Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KANSAI KAGAKU SHOJI KK
Original Assignee
KANSAI KAGAKU SHOJI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KANSAI KAGAKU SHOJI KK filed Critical KANSAI KAGAKU SHOJI KK
Priority to JP53075013A priority Critical patent/JPS5822235B2/en
Publication of JPS555229A publication Critical patent/JPS555229A/en
Publication of JPS5822235B2 publication Critical patent/JPS5822235B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Details Of Cutting Devices (AREA)
JP53075013A 1978-06-20 1978-06-20 Underlay for cutting Expired JPS5822235B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53075013A JPS5822235B2 (en) 1978-06-20 1978-06-20 Underlay for cutting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53075013A JPS5822235B2 (en) 1978-06-20 1978-06-20 Underlay for cutting

Publications (2)

Publication Number Publication Date
JPS555229A true JPS555229A (en) 1980-01-16
JPS5822235B2 JPS5822235B2 (en) 1983-05-07

Family

ID=13563867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53075013A Expired JPS5822235B2 (en) 1978-06-20 1978-06-20 Underlay for cutting

Country Status (1)

Country Link
JP (1) JPS5822235B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH059331U (en) * 1991-06-12 1993-02-09 ロイヤル株式会社 Sewing stand
US11018112B2 (en) 2014-10-30 2021-05-25 Kabushiki Kaisha Toshiba Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4865343U (en) * 1971-11-22 1973-08-18
JPS5147987U (en) * 1974-10-07 1976-04-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4865343U (en) * 1971-11-22 1973-08-18
JPS5147987U (en) * 1974-10-07 1976-04-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH059331U (en) * 1991-06-12 1993-02-09 ロイヤル株式会社 Sewing stand
US11018112B2 (en) 2014-10-30 2021-05-25 Kabushiki Kaisha Toshiba Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

Also Published As

Publication number Publication date
JPS5822235B2 (en) 1983-05-07

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