JPS5554941U - - Google Patents
Info
- Publication number
- JPS5554941U JPS5554941U JP1978139979U JP13997978U JPS5554941U JP S5554941 U JPS5554941 U JP S5554941U JP 1978139979 U JP1978139979 U JP 1978139979U JP 13997978 U JP13997978 U JP 13997978U JP S5554941 U JPS5554941 U JP S5554941U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978139979U JPS5554941U (2) | 1978-10-11 | 1978-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978139979U JPS5554941U (2) | 1978-10-11 | 1978-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5554941U true JPS5554941U (2) | 1980-04-14 |
Family
ID=29114522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978139979U Pending JPS5554941U (2) | 1978-10-11 | 1978-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5554941U (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58155837U (ja) * | 1982-04-12 | 1983-10-18 | 田中電子工業株式会社 | 半導体用ボンデイングワイヤ−スプ−ル |
-
1978
- 1978-10-11 JP JP1978139979U patent/JPS5554941U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58155837U (ja) * | 1982-04-12 | 1983-10-18 | 田中電子工業株式会社 | 半導体用ボンデイングワイヤ−スプ−ル |