JPS5555554A - Semiconductor element - Google Patents
Semiconductor elementInfo
- Publication number
- JPS5555554A JPS5555554A JP11888179A JP11888179A JPS5555554A JP S5555554 A JPS5555554 A JP S5555554A JP 11888179 A JP11888179 A JP 11888179A JP 11888179 A JP11888179 A JP 11888179A JP S5555554 A JPS5555554 A JP S5555554A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H10W74/476—Organic materials comprising silicon
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US94332578A | 1978-09-18 | 1978-09-18 | |
| US943325 | 1978-09-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5555554A true JPS5555554A (en) | 1980-04-23 |
| JPS6046542B2 JPS6046542B2 (en) | 1985-10-16 |
Family
ID=25479456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54118881A Expired JPS6046542B2 (en) | 1978-09-18 | 1979-09-18 | semiconductor element |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS6046542B2 (en) |
| CH (1) | CH661932A5 (en) |
| DE (1) | DE2937547A1 (en) |
| NL (1) | NL7906941A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0243221A (en) * | 1988-06-10 | 1990-02-13 | Occidental Chem Corp | New soluble polyimide siloxane and its manufacture and use |
| JPH02277416A (en) * | 1989-04-19 | 1990-11-14 | Fujii Kinzoku Kako Kk | Flying pan capable of self-controlling in temperature |
| JPH03195730A (en) * | 1989-12-25 | 1991-08-27 | Hitachi Chem Co Ltd | Siloxane modified polyimide and precursor thereof |
| JPH05331283A (en) * | 1992-06-04 | 1993-12-14 | Sumitomo Bakelite Co Ltd | Polyimide resin |
| JPH05331446A (en) * | 1992-06-04 | 1993-12-14 | Sumitomo Bakelite Co Ltd | High-molecular weight polyimide resin film adhesive |
| JP2009249872A (en) * | 2008-04-03 | 2009-10-29 | Japan Delivery System Corp | Electric lock |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3247938A1 (en) * | 1982-12-24 | 1984-07-05 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Semiconductor device having high reverse-voltage handling capacity |
| JPS62201734U (en) * | 1986-06-13 | 1987-12-23 | ||
| JPS63194335U (en) * | 1987-06-01 | 1988-12-14 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3615913A (en) * | 1968-11-08 | 1971-10-26 | Westinghouse Electric Corp | Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1246886B (en) * | 1960-07-30 | 1967-08-10 | Elektronik M B H | Process for stabilizing and improving the blocking properties of semiconductor components |
| US3740305A (en) * | 1971-10-01 | 1973-06-19 | Gen Electric | Composite materials bonded with siloxane containing polyimides |
| SE418432B (en) * | 1975-12-11 | 1981-05-25 | Gen Electric | SET FOR TREATMENT OF A SELECTED AREA WITH A SEMICONDUCTOR |
| DE2632647A1 (en) * | 1976-07-20 | 1978-01-26 | Siemens Ag | SEMICONDUCTOR COMPONENT WITH PASSIVATING PROTECTIVE LAYER |
-
1979
- 1979-09-14 CH CH8356/79A patent/CH661932A5/en not_active IP Right Cessation
- 1979-09-17 DE DE19792937547 patent/DE2937547A1/en not_active Ceased
- 1979-09-18 NL NL7906941A patent/NL7906941A/en not_active Application Discontinuation
- 1979-09-18 JP JP54118881A patent/JPS6046542B2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3615913A (en) * | 1968-11-08 | 1971-10-26 | Westinghouse Electric Corp | Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0243221A (en) * | 1988-06-10 | 1990-02-13 | Occidental Chem Corp | New soluble polyimide siloxane and its manufacture and use |
| JPH02277416A (en) * | 1989-04-19 | 1990-11-14 | Fujii Kinzoku Kako Kk | Flying pan capable of self-controlling in temperature |
| JPH03195730A (en) * | 1989-12-25 | 1991-08-27 | Hitachi Chem Co Ltd | Siloxane modified polyimide and precursor thereof |
| JPH05331283A (en) * | 1992-06-04 | 1993-12-14 | Sumitomo Bakelite Co Ltd | Polyimide resin |
| JPH05331446A (en) * | 1992-06-04 | 1993-12-14 | Sumitomo Bakelite Co Ltd | High-molecular weight polyimide resin film adhesive |
| JP2009249872A (en) * | 2008-04-03 | 2009-10-29 | Japan Delivery System Corp | Electric lock |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6046542B2 (en) | 1985-10-16 |
| DE2937547A1 (en) | 1980-03-27 |
| NL7906941A (en) | 1980-03-20 |
| CH661932A5 (en) | 1987-08-31 |
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