JPS5558502A - Electrically resistive foil and method of manufacturing same - Google Patents
Electrically resistive foil and method of manufacturing sameInfo
- Publication number
- JPS5558502A JPS5558502A JP11686079A JP11686079A JPS5558502A JP S5558502 A JPS5558502 A JP S5558502A JP 11686079 A JP11686079 A JP 11686079A JP 11686079 A JP11686079 A JP 11686079A JP S5558502 A JPS5558502 A JP S5558502A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing same
- electrically resistive
- resistive foil
- foil
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7836698 | 1978-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5558502A true JPS5558502A (en) | 1980-05-01 |
Family
ID=10499647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11686079A Pending JPS5558502A (en) | 1978-09-13 | 1979-09-13 | Electrically resistive foil and method of manufacturing same |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS5558502A (fr) |
| BE (1) | BE878782A (fr) |
| DE (1) | DE2936904A1 (fr) |
| FI (1) | FI792843A7 (fr) |
| FR (1) | FR2436198A1 (fr) |
| IT (1) | IT1123596B (fr) |
| LU (1) | LU81680A1 (fr) |
| NL (1) | NL7906808A (fr) |
| SE (1) | SE7907594L (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2590487A1 (fr) | 2011-11-03 | 2013-05-08 | Nan-Ya Plastics Corporation | Procédé de fabrication de feuille de cuivre à grain fin en surface avec résistance élevée au pelage et protection environnementale pour les cartes de circuit imprimé |
| US9115441B2 (en) | 2011-10-18 | 2015-08-25 | Nan Ya Plastics Corporation | Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014210914A1 (de) * | 2014-06-06 | 2015-12-17 | Conti Temic Microelectronic Gmbh | Flexible Leiterplattenstruktur und die Verwendung der flexiblen Leiterplattenstruktur in einem Steuergerät für ein Kraftfahrzeug |
-
1979
- 1979-09-12 LU LU81680A patent/LU81680A1/fr unknown
- 1979-09-12 NL NL7906808A patent/NL7906808A/nl not_active Application Discontinuation
- 1979-09-12 FR FR7922762A patent/FR2436198A1/fr not_active Withdrawn
- 1979-09-12 SE SE7907594A patent/SE7907594L/xx unknown
- 1979-09-12 DE DE19792936904 patent/DE2936904A1/de not_active Withdrawn
- 1979-09-12 IT IT25660/79A patent/IT1123596B/it active
- 1979-09-13 FI FI792843A patent/FI792843A7/fi not_active Application Discontinuation
- 1979-09-13 JP JP11686079A patent/JPS5558502A/ja active Pending
- 1979-09-13 BE BE0/197143A patent/BE878782A/fr unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9115441B2 (en) | 2011-10-18 | 2015-08-25 | Nan Ya Plastics Corporation | Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards |
| EP2590487A1 (fr) | 2011-11-03 | 2013-05-08 | Nan-Ya Plastics Corporation | Procédé de fabrication de feuille de cuivre à grain fin en surface avec résistance élevée au pelage et protection environnementale pour les cartes de circuit imprimé |
Also Published As
| Publication number | Publication date |
|---|---|
| BE878782A (fr) | 1979-12-31 |
| FR2436198A1 (fr) | 1980-04-11 |
| FI792843A7 (fi) | 1981-01-01 |
| NL7906808A (nl) | 1980-03-17 |
| SE7907594L (sv) | 1980-03-14 |
| IT1123596B (it) | 1986-04-30 |
| DE2936904A1 (de) | 1980-04-03 |
| IT7925660A0 (it) | 1979-09-12 |
| LU81680A1 (fr) | 1980-01-24 |
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