JPS555873B2 - - Google Patents
Info
- Publication number
- JPS555873B2 JPS555873B2 JP2351574A JP2351574A JPS555873B2 JP S555873 B2 JPS555873 B2 JP S555873B2 JP 2351574 A JP2351574 A JP 2351574A JP 2351574 A JP2351574 A JP 2351574A JP S555873 B2 JPS555873 B2 JP S555873B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2351574A JPS555873B2 (fr) | 1974-02-28 | 1974-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2351574A JPS555873B2 (fr) | 1974-02-28 | 1974-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50116955A JPS50116955A (fr) | 1975-09-12 |
| JPS555873B2 true JPS555873B2 (fr) | 1980-02-12 |
Family
ID=12112573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2351574A Expired JPS555873B2 (fr) | 1974-02-28 | 1974-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS555873B2 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010068005A (ja) * | 2009-12-22 | 2010-03-25 | Hitachi Chem Co Ltd | 多層プリント配線板の製造方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2561692B2 (ja) * | 1988-03-24 | 1996-12-11 | 日立化成工業株式会社 | 片面プリント配線板の製造方法 |
| JPH01287989A (ja) * | 1988-05-14 | 1989-11-20 | Matsushita Electric Works Ltd | プリントの配線板の製造方法 |
| US4918812A (en) * | 1988-06-29 | 1990-04-24 | International Business Machines Corporation | Processing of cores for circuit boards or cards |
| JPH0756909B2 (ja) * | 1988-11-30 | 1995-06-14 | 新神戸電機株式会社 | 片面印刷回路板の製造法および製造装置ならびに前記製造に用いる金属箔張積層板 |
| JP2009253219A (ja) * | 2008-04-10 | 2009-10-29 | Denka Agsp Kk | 配線基板の製造方法 |
| JP2010056165A (ja) * | 2008-08-26 | 2010-03-11 | Denso Corp | 導体パターンフィルムの製造方法 |
-
1974
- 1974-02-28 JP JP2351574A patent/JPS555873B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010068005A (ja) * | 2009-12-22 | 2010-03-25 | Hitachi Chem Co Ltd | 多層プリント配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50116955A (fr) | 1975-09-12 |