JPS555930A - Semiconductor sealing epoxy resin composition - Google Patents
Semiconductor sealing epoxy resin compositionInfo
- Publication number
- JPS555930A JPS555930A JP7770878A JP7770878A JPS555930A JP S555930 A JPS555930 A JP S555930A JP 7770878 A JP7770878 A JP 7770878A JP 7770878 A JP7770878 A JP 7770878A JP S555930 A JPS555930 A JP S555930A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- polyamide
- semiconductor sealing
- sealing epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 5
- 229920000647 polyepoxide Polymers 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 title abstract 4
- 238000007789 sealing Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000004952 Polyamide Substances 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 229920002647 polyamide Polymers 0.000 abstract 3
- 150000004668 long chain fatty acids Chemical class 0.000 abstract 2
- 229920000768 polyamine Polymers 0.000 abstract 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 abstract 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 abstract 1
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical class CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: An epoxy resin composition for sealing semiconductors having improved releasability, imprintability, and adhesivity, comprising an epoxy resin and a polyamide as an internal release agent.
CONSTITUTION: An epoxy resin composition comprising (A) a polyamide prepared by condensing a ≥22C long-chain fatty acid with an aliphatic polyamine, as an internal release agent, (B) a curing agent, and (C) an epoxy resin, and, if necessary, (D) a curing accelerator, and other additives. Behenic, montanic acids, etc. may be cited as the long-chain fatty acid. Ethylenediamine, diethylenetriamine, etc. may be cited as the polyamine. The amount of the polyamide is 0.2W2.0wt.%, preferably 0.3W1.0wt.% based on the total composition.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7770878A JPS555930A (en) | 1978-06-26 | 1978-06-26 | Semiconductor sealing epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7770878A JPS555930A (en) | 1978-06-26 | 1978-06-26 | Semiconductor sealing epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS555930A true JPS555930A (en) | 1980-01-17 |
| JPS5652941B2 JPS5652941B2 (en) | 1981-12-15 |
Family
ID=13641388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7770878A Granted JPS555930A (en) | 1978-06-26 | 1978-06-26 | Semiconductor sealing epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS555930A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6475554A (en) * | 1987-09-17 | 1989-03-22 | Toshiba Corp | Epoxy resin composition and resin-sealing type semiconductor device |
| JP2011126881A (en) * | 2009-12-18 | 2011-06-30 | Xerox Corp | Pigment dispersant of low molecular weight for phase change ink |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128199A (en) * | 1974-09-02 | 1976-03-09 | Hitachi Ltd | EHOKISHIJUSHISOSEIBUTSU |
| JPS5447748A (en) * | 1977-09-22 | 1979-04-14 | Toei Chemical Kk | Plasticizer |
-
1978
- 1978-06-26 JP JP7770878A patent/JPS555930A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128199A (en) * | 1974-09-02 | 1976-03-09 | Hitachi Ltd | EHOKISHIJUSHISOSEIBUTSU |
| JPS5447748A (en) * | 1977-09-22 | 1979-04-14 | Toei Chemical Kk | Plasticizer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6475554A (en) * | 1987-09-17 | 1989-03-22 | Toshiba Corp | Epoxy resin composition and resin-sealing type semiconductor device |
| JP2011126881A (en) * | 2009-12-18 | 2011-06-30 | Xerox Corp | Pigment dispersant of low molecular weight for phase change ink |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5652941B2 (en) | 1981-12-15 |
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