JPS5561077A - Photoelectric converter - Google Patents
Photoelectric converterInfo
- Publication number
- JPS5561077A JPS5561077A JP13436878A JP13436878A JPS5561077A JP S5561077 A JPS5561077 A JP S5561077A JP 13436878 A JP13436878 A JP 13436878A JP 13436878 A JP13436878 A JP 13436878A JP S5561077 A JPS5561077 A JP S5561077A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight parts
- photoelectric converter
- visible light
- metal wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Light Receiving Elements (AREA)
Abstract
PURPOSE:To make a filter and a lens unneeded and simplify and reduce the size of a device, by using as the potting material to cover the photoelectric converter element, epoxy resin containing oil-soluble monoazo type dye which shuts off the transmission of visible light spectra. CONSTITUTION:Photoelectric converter element 2 is fixed on Kovar stem 6 with lead pin 7 projecting in its lower part. The electrode provided on the surface of element 2 is connected to lead pin 7', which is insulated from and passes stem 6, by means of metal wire 8. Next, element 2 and metal wire 8 are covered with epoxy resin 1'. Resin 1', which is the potting material at this time, is prepared as follows. A mixture containing bisphenol type epoxy resin, 30-60 weight parts, and alicyclic glycidyl ester type epoxy resin, 30-0 weight parts, to which are added phthalic anhydride, 65-75 weight parts, which is a hardener, and oil-soluble monoaxo type dye, 0.01-1 weight part, which absorbs visible light spectra. This is formed into a lens shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13436878A JPS5561077A (en) | 1978-10-30 | 1978-10-30 | Photoelectric converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13436878A JPS5561077A (en) | 1978-10-30 | 1978-10-30 | Photoelectric converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5561077A true JPS5561077A (en) | 1980-05-08 |
Family
ID=15126736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13436878A Pending JPS5561077A (en) | 1978-10-30 | 1978-10-30 | Photoelectric converter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5561077A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58182281A (en) * | 1982-04-19 | 1983-10-25 | Nec Corp | Photoelectric converter |
| JPS60119760A (en) * | 1983-11-30 | 1985-06-27 | Nitto Electric Ind Co Ltd | Resin-encapsulated semiconductor device |
| JPS6357757U (en) * | 1986-10-01 | 1988-04-18 |
-
1978
- 1978-10-30 JP JP13436878A patent/JPS5561077A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58182281A (en) * | 1982-04-19 | 1983-10-25 | Nec Corp | Photoelectric converter |
| JPS60119760A (en) * | 1983-11-30 | 1985-06-27 | Nitto Electric Ind Co Ltd | Resin-encapsulated semiconductor device |
| JPS6357757U (en) * | 1986-10-01 | 1988-04-18 |
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