JPS5565217A - Preparation of heat-resistant resin - Google Patents

Preparation of heat-resistant resin

Info

Publication number
JPS5565217A
JPS5565217A JP13961978A JP13961978A JPS5565217A JP S5565217 A JPS5565217 A JP S5565217A JP 13961978 A JP13961978 A JP 13961978A JP 13961978 A JP13961978 A JP 13961978A JP S5565217 A JPS5565217 A JP S5565217A
Authority
JP
Japan
Prior art keywords
heat
epoxy resin
resin
sensitizer
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13961978A
Other languages
Japanese (ja)
Other versions
JPS592445B2 (en
Inventor
Akira Fukami
Shohei Eto
Hiroyuki Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13961978A priority Critical patent/JPS592445B2/en
Publication of JPS5565217A publication Critical patent/JPS5565217A/en
Publication of JPS592445B2 publication Critical patent/JPS592445B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE: To prepare a resin having low dielectric loss, giving a molded article free from flash and effective to suppress the corona discharge, by irradiating a composition comprising a maleimide compound, an epoxy resin, a curing agent and a sensitizer, with light, and curing the product with heat.
CONSTITUTION: A resin composition comprising (A) one or more maleimide compounds I or II (R1 is ≥2C divalent group; R2 is H or alkyl; n is 0.5W5 on an average), (B) an epoxy resin (e.g. bisphenol-A diglycidyl ether, etc.), (C) a curing agent for the epoxy resin (e.g. acid anhydrides, metal chelate compounds, etc.) and (D) a sensitizer (e.g. benzoin, etc.), is irradiated with light, and the semi-cured product thus obtained is cured with heat. The preferable ratios by weight of A/ (B+C) and D/A are (5W200)/100 and (0.05W10)/100, respectively.
COPYRIGHT: (C)1980,JPO&Japio
JP13961978A 1978-11-10 1978-11-10 Manufacturing method of heat-resistant resin Expired JPS592445B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13961978A JPS592445B2 (en) 1978-11-10 1978-11-10 Manufacturing method of heat-resistant resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13961978A JPS592445B2 (en) 1978-11-10 1978-11-10 Manufacturing method of heat-resistant resin

Publications (2)

Publication Number Publication Date
JPS5565217A true JPS5565217A (en) 1980-05-16
JPS592445B2 JPS592445B2 (en) 1984-01-18

Family

ID=15249498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13961978A Expired JPS592445B2 (en) 1978-11-10 1978-11-10 Manufacturing method of heat-resistant resin

Country Status (1)

Country Link
JP (1) JPS592445B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6833629B2 (en) 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
JP2011506665A (en) * 2007-12-17 2011-03-03 フレクシス ホールディング ビー．ブイ． Curing system and coating obtained thereby

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6833629B2 (en) 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
JP2011506665A (en) * 2007-12-17 2011-03-03 フレクシス ホールディング ビー．ブイ． Curing system and coating obtained thereby

Also Published As

Publication number Publication date
JPS592445B2 (en) 1984-01-18

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