JPS5565280A - Polyamide hot-melt adhesive - Google Patents

Polyamide hot-melt adhesive

Info

Publication number
JPS5565280A
JPS5565280A JP13823578A JP13823578A JPS5565280A JP S5565280 A JPS5565280 A JP S5565280A JP 13823578 A JP13823578 A JP 13823578A JP 13823578 A JP13823578 A JP 13823578A JP S5565280 A JPS5565280 A JP S5565280A
Authority
JP
Japan
Prior art keywords
polyamine
reacting
molecule
bonding
amino groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13823578A
Other languages
Japanese (ja)
Inventor
Koichi Honma
Yoshitomo Nakano
Katsuhiro Abe
Hiroshi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP13823578A priority Critical patent/JPS5565280A/en
Publication of JPS5565280A publication Critical patent/JPS5565280A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polyamides (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To provide the title adhesive having excellent water resistance, flexibility, heat resistance and adhesivity, composed of a polyamide obtained by reacting a polyamine having two or more amino groups in a molecule with a specific polybasic carboxylic acid.
CONSTITUTION: An adhesive composition composed mainly of a polyamide obtained by reacting (A) a 5W50C polybasic carboxylic acid obtained by the oxidative decomposition of a ≥20C chain hydrocarbon (e.g. polyethylene, isotactic polypropylene, etc.) with mixed acid at 50W120°C under vigorous agitation, with (B) a polyamine having two or more amino groups in a molecule (e.g. polalkylenepolyamine, cycloaliphatic polyamine, etc.).
USE: Bonding of electronic parts; side-seaming of container; lamination of veneers by impregnating in fibers; bonding of polar adherends such as steel, aluminum, glass, stone, thermosetting resin, paper, etc.
COPYRIGHT: (C)1980,JPO&Japio
JP13823578A 1978-11-09 1978-11-09 Polyamide hot-melt adhesive Pending JPS5565280A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13823578A JPS5565280A (en) 1978-11-09 1978-11-09 Polyamide hot-melt adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13823578A JPS5565280A (en) 1978-11-09 1978-11-09 Polyamide hot-melt adhesive

Publications (1)

Publication Number Publication Date
JPS5565280A true JPS5565280A (en) 1980-05-16

Family

ID=15217234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13823578A Pending JPS5565280A (en) 1978-11-09 1978-11-09 Polyamide hot-melt adhesive

Country Status (1)

Country Link
JP (1) JPS5565280A (en)

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