JPS556835A - Device for soldering on circuit board - Google Patents

Device for soldering on circuit board

Info

Publication number: JPS556835A
Authority: JP; Japan
Prior art keywords: soldering; circuit board; board; circuit
Prior art date: 1978-06-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP7895678A

Other languages

Japanese (ja)

Other versions

JPS612317B2 (en

Inventor

Kuniyasu Nagata

Hisafumi Yoshida

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nippon Mektron KK

Original Assignee

Nippon Mektron KK

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-06-29

Filing date

1978-06-29

Publication date

1980-01-18

1978-06-29 Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK

1978-06-29 Priority to JP7895678A priority Critical patent/JPS556835A/en

1980-01-18 Publication of JPS556835A publication Critical patent/JPS556835A/en

1986-01-23 Publication of JPS612317B2 publication Critical patent/JPS612317B2/ja

Status Granted legal-status Critical Current

Links

238000005476 soldering Methods 0.000 title 1

Landscapes

Molten Solder (AREA)
Manufacturing Of Printed Wiring (AREA)

JP7895678A 1978-06-29 1978-06-29 Device for soldering on circuit board Granted JPS556835A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP7895678A JPS556835A (en)	1978-06-29	1978-06-29	Device for soldering on circuit board

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP7895678A JPS556835A (en)	1978-06-29	1978-06-29	Device for soldering on circuit board

Publications (2)

Publication Number	Publication Date
JPS556835A true JPS556835A (en)	1980-01-18
JPS612317B2 JPS612317B2 (en)	1986-01-23

Family

ID=13676332

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP7895678A Granted JPS556835A (en)	1978-06-29	1978-06-29	Device for soldering on circuit board

Country Status (1)

Country	Link
JP (1)	JPS556835A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6414589A (en) *	1987-04-03	1989-01-18	San E Co De	Method and apparatus for applying multi- layer insulation fireproof coating

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102184874B (en) *	2011-04-02	2012-12-26	何永基	Chip bonding method

1978
- 1978-06-29 JP JP7895678A patent/JPS556835A/en active Granted

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6414589A (en) *	1987-04-03	1989-01-18	San E Co De	Method and apparatus for applying multi- layer insulation fireproof coating
JPH0373899U (en) *	1987-04-03	1991-07-25

Also Published As

Publication number	Publication date
JPS612317B2 (en)	1986-01-23

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