JPS5569421A - Modling of frame for electric appliance - Google Patents

Modling of frame for electric appliance

Info

Publication number
JPS5569421A
JPS5569421A JP14274178A JP14274178A JPS5569421A JP S5569421 A JPS5569421 A JP S5569421A JP 14274178 A JP14274178 A JP 14274178A JP 14274178 A JP14274178 A JP 14274178A JP S5569421 A JPS5569421 A JP S5569421A
Authority
JP
Japan
Prior art keywords
frame
metal plate
synthetic resin
projected end
modling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14274178A
Other languages
Japanese (ja)
Other versions
JPS6049083B2 (en
Inventor
Hideo Nagaizumi
Tsutomu Muranaka
Masakazu Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP14274178A priority Critical patent/JPS6049083B2/en
Publication of JPS5569421A publication Critical patent/JPS5569421A/en
Publication of JPS6049083B2 publication Critical patent/JPS6049083B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To prevent deformation at the projected end of a metal plate by means of a pin provided in the mold when the intended frame is obtained by outsert molding of a synthetic resin on the metal plate having such a projected end.
CONSTITUTION: Synthetic resin is outsert molded to form a frame body 15 on a metal plate. Thus, a frame is formed for electric appliances. Here, a projected end 12 of the metal plate is fixed in contact with a pin 22 provided for the mold 20, and then, a melted synthetic resin is infected from the tip of a gate 21 filling the cavity of the lower die 23 and that of the upper die 22 for molding. This can prevent upward deformation of the end 21 due to the pressure of the resin injected without use of any tongue piece.
COPYRIGHT: (C)1980,JPO&Japio
JP14274178A 1978-11-18 1978-11-18 Molding method for electrical equipment frames Expired JPS6049083B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14274178A JPS6049083B2 (en) 1978-11-18 1978-11-18 Molding method for electrical equipment frames

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14274178A JPS6049083B2 (en) 1978-11-18 1978-11-18 Molding method for electrical equipment frames

Publications (2)

Publication Number Publication Date
JPS5569421A true JPS5569421A (en) 1980-05-26
JPS6049083B2 JPS6049083B2 (en) 1985-10-31

Family

ID=15322492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14274178A Expired JPS6049083B2 (en) 1978-11-18 1978-11-18 Molding method for electrical equipment frames

Country Status (1)

Country Link
JP (1) JPS6049083B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531950A (en) * 1993-09-07 1996-07-02 Fujitsu Limited Method of manufacturing a casing for an electronic apparatus
JP2015085580A (en) * 2013-10-30 2015-05-07 日本プラスト株式会社 Resin molded product and method for molding resin molded product

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1300281C (en) * 2004-12-08 2007-02-14 中国科学院长春应用化学研究所 Vacuum ultraviolet excited rare-earth borovanadate system red fluorescent powder and preparing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531950A (en) * 1993-09-07 1996-07-02 Fujitsu Limited Method of manufacturing a casing for an electronic apparatus
JP2015085580A (en) * 2013-10-30 2015-05-07 日本プラスト株式会社 Resin molded product and method for molding resin molded product

Also Published As

Publication number Publication date
JPS6049083B2 (en) 1985-10-31

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