JPS5570040A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5570040A
JPS5570040A JP14363278A JP14363278A JPS5570040A JP S5570040 A JPS5570040 A JP S5570040A JP 14363278 A JP14363278 A JP 14363278A JP 14363278 A JP14363278 A JP 14363278A JP S5570040 A JPS5570040 A JP S5570040A
Authority
JP
Japan
Prior art keywords
wire
plate
electromagnet
tension
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14363278A
Other languages
Japanese (ja)
Other versions
JPS5850422B2 (en
Inventor
Toshiji Tanabe
Haruo Tada
Masakatsu Munetomo
Yukio Yamaguchi
Zenichiro Tabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP53143632A priority Critical patent/JPS5850422B2/en
Publication of JPS5570040A publication Critical patent/JPS5570040A/en
Publication of JPS5850422B2 publication Critical patent/JPS5850422B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To impart a fine metallic wire with an optinum tension adapted for wire bonding process by electrically controlling a force for disposing the wire via a grip for wire bonding process by an electromagnet.
CONSTITUTION: Glass plates 10 and 11 for gripping a fine metallic wire 5 are engaged within the stationary frame 15 of a support 14, a magnetic metal plate 16 is placed on the plate 11, and an electromagnet 17 and an electromagnetic coil 18 are disposed under the plate 10. The upper plate 11 is urged toward the supporting plate 14 by the attracting force of the plate 16 occurred by the electromagnet 17 to thereby grip the wire 5. Thus, by considering the moving state of capillary, current flown through the coil 18 is controlled to thereby vary the tension imparted to the wire 5 so as to impart an optinum tension thereto.
COPYRIGHT: (C)1980,JPO&Japio
JP53143632A 1978-11-20 1978-11-20 wire bonding equipment Expired JPS5850422B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53143632A JPS5850422B2 (en) 1978-11-20 1978-11-20 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53143632A JPS5850422B2 (en) 1978-11-20 1978-11-20 wire bonding equipment

Publications (2)

Publication Number Publication Date
JPS5570040A true JPS5570040A (en) 1980-05-27
JPS5850422B2 JPS5850422B2 (en) 1983-11-10

Family

ID=15343264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53143632A Expired JPS5850422B2 (en) 1978-11-20 1978-11-20 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS5850422B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61104547U (en) * 1984-12-13 1986-07-03
JP2007227451A (en) * 2006-02-21 2007-09-06 Tanaka Seiki Kk Wire holding device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0177625U (en) * 1988-11-09 1989-05-25

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61104547U (en) * 1984-12-13 1986-07-03
JP2007227451A (en) * 2006-02-21 2007-09-06 Tanaka Seiki Kk Wire holding device

Also Published As

Publication number Publication date
JPS5850422B2 (en) 1983-11-10

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