JPS5570048A - Method of marking resin sealed semiconductor device - Google Patents

Method of marking resin sealed semiconductor device

Info

Publication number
JPS5570048A
JPS5570048A JP14338478A JP14338478A JPS5570048A JP S5570048 A JPS5570048 A JP S5570048A JP 14338478 A JP14338478 A JP 14338478A JP 14338478 A JP14338478 A JP 14338478A JP S5570048 A JPS5570048 A JP S5570048A
Authority
JP
Japan
Prior art keywords
mark
semiconductor device
resin
marking
sealed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14338478A
Other languages
Japanese (ja)
Inventor
Goro Tanaka
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14338478A priority Critical patent/JPS5570048A/en
Publication of JPS5570048A publication Critical patent/JPS5570048A/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Methods (AREA)

Abstract

PURPOSE: To print a mark having high holding property on a resin surface of the portion to be marked in a resin sealed semiconductor device by marking the resin surface after grinding it to thereby eliminate surface cleaning process affecting adversely the reliability of the device.
CONSTITUTION: After sealing and hardening with resin material a semiconductor device such as MOSIC or the like by transfer forming or injection molding or the like, the resin surface of the device is ground by a sand paper process, a sandblasting process, a buff polishing process, etc. A mark is printed on the polished portion, and heated for drying it. Thus, the mark may not be erased even without cleaning it by trichloroethylene before marking for preventing the diminution of the mark to thereby eliminate the damage rate due to the mark in the semiconductor device.
COPYRIGHT: (C)1980,JPO&Japio
JP14338478A 1978-11-22 1978-11-22 Method of marking resin sealed semiconductor device Pending JPS5570048A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14338478A JPS5570048A (en) 1978-11-22 1978-11-22 Method of marking resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14338478A JPS5570048A (en) 1978-11-22 1978-11-22 Method of marking resin sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5570048A true JPS5570048A (en) 1980-05-27

Family

ID=15337510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14338478A Pending JPS5570048A (en) 1978-11-22 1978-11-22 Method of marking resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5570048A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0805019A1 (en) * 1996-04-30 1997-11-05 Horikawa Co., Ltd. Method of manufacturing a multicolored molded plastic product for eyeglasses having a stereographic pattern
JP2013093403A (en) * 2011-10-25 2013-05-16 Murata Mfg Co Ltd Method for printing on electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0805019A1 (en) * 1996-04-30 1997-11-05 Horikawa Co., Ltd. Method of manufacturing a multicolored molded plastic product for eyeglasses having a stereographic pattern
JP2013093403A (en) * 2011-10-25 2013-05-16 Murata Mfg Co Ltd Method for printing on electronic component

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