JPS557018B1 - - Google Patents

Info

Publication number: JPS557018B1
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP4690871A

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1970-06-29

Filing date

1971-06-29

Publication date

1980-02-21

1971-06-29 Application filed filed Critical

1980-02-21 Publication of JPS557018B1 publication Critical patent/JPS557018B1/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/66—Wet etching of conductive or resistive materials
- H10P50/663—Wet etching of conductive or resistive materials by chemical means only
- H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/041—Doping control in crystal growth
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/042—Doping, graded, for tapered etching
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/049—Equivalence and options
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/051—Etching
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/067—Graded energy gap
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/122—Polycrystalline

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Weting (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

JP4690871A 1970-06-29 1971-06-29 Pending JPS557018B1 (ja)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US5078070A	1970-06-29	1970-06-29

Publications (1)

Publication Number	Publication Date
JPS557018B1 true JPS557018B1 (ja)	1980-02-21

Family

ID=21967382

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP4690871A Pending JPS557018B1 (ja)	1970-06-29	1971-06-29

Country Status (9)

Country	Link
US (1)	US3675319A (ja)
JP (1)	JPS557018B1 (ja)
BE (1)	BE768899A (ja)
CA (1)	CA922425A (ja)
DE (1)	DE2132099C3 (ja)
FR (1)	FR2096566B1 (ja)
GB (1)	GB1348731A (ja)
NL (1)	NL174413C (ja)
SE (1)	SE373983B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3936331A (en) *	1974-04-01	1976-02-03	Fairchild Camera And Instrument Corporation	Process for forming sloped topography contact areas between polycrystalline silicon and single-crystal silicon
GB1501114A (en) *	1974-04-25	1978-02-15	Rca Corp	Method of making a semiconductor device
US4181564A (en) *	1978-04-24	1980-01-01	Bell Telephone Laboratories, Incorporated	Fabrication of patterned silicon nitride insulating layers having gently sloping sidewalls
US4354309A (en) *	1978-12-29	1982-10-19	International Business Machines Corp.	Method of manufacturing a metal-insulator-semiconductor device utilizing a graded deposition of polycrystalline silicon
US5285571A (en) *	1992-10-13	1994-02-15	General Electric Company	Method for extending an electrical conductor over an edge of an HDI substrate
DE19649972C2 (de) *	1996-11-22	2002-11-07	Siemens Ag	Verfahren zur Herstellung eines Leitungssatzes für Kraftfahrzeuge
US20140264340A1 (en) *	2013-03-14	2014-09-18	Sandia Corporation	Reversible hybridization of large surface area array electronics
US9905471B2 (en) *	2016-04-28	2018-02-27	Taiwan Semiconductor Manufacturing Co., Ltd.	Integrated circuit structure and method forming trenches with different depths

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS50193A (ja) *	1973-05-15	1975-01-06

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3260634A (en) *	1961-02-17	1966-07-12	Motorola Inc	Method of etching a semiconductor wafer to provide tapered dice
NL285523A (ja) *	1961-11-24
FR1379429A (fr) *	1963-01-31	1964-11-20	Motorola Inc	Procédé d'isolement électrique pour circuits miniaturisés
DE1564896A1 (de) *	1966-08-30	1970-01-08	Telefunken Patent	Halbleiteranordnung
BE758160A (fr) *	1969-10-31	1971-04-01	Fairchild Camera Instr Co	Structure metallique a couches multiples et procede de fabrication d'une telle structure

1970
- 1970-06-29 US US50780A patent/US3675319A/en not_active Expired - Lifetime
1971
- 1971-01-26 CA CA103683A patent/CA922425A/en not_active Expired
- 1971-06-18 SE SE7107962A patent/SE373983B/xx unknown
- 1971-06-23 BE BE768899A patent/BE768899A/xx not_active IP Right Cessation
- 1971-06-23 NL NLAANVRAGE7108656,A patent/NL174413C/xx not_active IP Right Cessation
- 1971-06-24 GB GB2961271A patent/GB1348731A/en not_active Expired
- 1971-06-28 DE DE2132099A patent/DE2132099C3/de not_active Expired
- 1971-06-28 FR FR7123522A patent/FR2096566B1/fr not_active Expired
- 1971-06-29 JP JP4690871A patent/JPS557018B1/ja active Pending

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS50193A (ja) *	1973-05-15	1975-01-06

Also Published As

Publication number	Publication date
BE768899A (fr)	1971-11-03
NL174413B (nl)	1984-01-02
SE373983B (ja)	1975-02-17
DE2132099A1 (de)	1972-01-05
FR2096566B1 (ja)	1975-02-07
NL174413C (nl)	1984-06-01
DE2132099C3 (de)	1983-12-01
US3675319A (en)	1972-07-11
CA922425A (en)	1973-03-06
GB1348731A (en)	1974-03-20
FR2096566A1 (ja)	1972-02-18
DE2132099B2 (de)	1979-10-11
NL7108656A (ja)	1971-12-31

Publication	Publication Date	Title
FR2096566B1 (ja)	1975-02-07
AU2044470A (ja)	1972-03-30
AU1473870A (ja)	1971-11-11
AU1146470A (ja)	1971-08-19
AU1716970A (ja)	1972-01-06
AU2017870A (ja)	1972-03-23
AU2085370A (ja)	1972-04-13
AU2130570A (ja)	1972-04-27
AU1517670A (ja)	1971-11-18
AU1326870A (ja)	1971-10-28
AU1336970A (ja)	1971-10-07
AU2115870A (ja)	1972-04-20
AU1247570A (ja)	1971-09-16
AU1969370A (ja)	1972-03-16
AU1974970A (ja)	1972-03-16
AU1689770A (ja)	1972-01-06
AU1603270A (ja)	1971-12-09
AU2061170A (ja)	1972-04-13
AU1343870A (ja)	1971-10-07
AU1064870A (ja)	1971-07-29
AU1789870A (ja)	1972-01-27
AU1328670A (ja)	1971-10-07
AU1086670A (ja)	1971-08-05
AU2144270A (ja)	1972-04-27
AU2131570A (ja)	1972-04-27