JPS5572048A - Semiconductor element - Google Patents
Semiconductor elementInfo
- Publication number
- JPS5572048A JPS5572048A JP14577078A JP14577078A JPS5572048A JP S5572048 A JPS5572048 A JP S5572048A JP 14577078 A JP14577078 A JP 14577078A JP 14577078 A JP14577078 A JP 14577078A JP S5572048 A JPS5572048 A JP S5572048A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- semiconductor
- alloy
- metal plate
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 229910000679 solder Inorganic materials 0.000 abstract 6
- 229910001128 Sn alloy Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000006104 solid solution Substances 0.000 abstract 2
- 238000005336 cracking Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To improve reliability of bonding between semiconductor chip and metal plate using a solder of which specific amount of Ga is added into Sn or Sn alloy.
CONSTITUTION: A semiconductor and a metal plate and bonded using a preformed solder of which Ga of 0.01W0.5wt% is contained in Sn or Sn alloy. When the amount added is less than 0.01wt%, the mechanical strength and anti-oxidizability of the solder are not improved because the Ga forms a solid-solution, and when it is more than 0.5wt%, the extensibility of the solder is checked by the excessive amount of the Ga solid-solution. Also, as a strain stress is created, it leads breaking of semiconductor element and the solder inself becomes fragile. Use of the solder having the above constitution eliminates wearing or breaking of junction part, cracking of chip and melting of junction part being on the use. So a stable and highly reliable junction is obtained.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14577078A JPS5572048A (en) | 1978-11-25 | 1978-11-25 | Semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14577078A JPS5572048A (en) | 1978-11-25 | 1978-11-25 | Semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5572048A true JPS5572048A (en) | 1980-05-30 |
Family
ID=15392754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14577078A Pending JPS5572048A (en) | 1978-11-25 | 1978-11-25 | Semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5572048A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0074500A3 (en) * | 1981-09-16 | 1984-04-04 | VDO Adolf Schindling AG | Liquid-crystal cell |
| US6475643B1 (en) * | 1999-11-01 | 2002-11-05 | Senju Metal Industry Co., Ltd. | Plated electrical leads |
| EP1166938A3 (en) * | 2000-06-30 | 2003-12-17 | Nihon Almit Co.,Ltd. | PB-free soldering alloy |
-
1978
- 1978-11-25 JP JP14577078A patent/JPS5572048A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0074500A3 (en) * | 1981-09-16 | 1984-04-04 | VDO Adolf Schindling AG | Liquid-crystal cell |
| US6475643B1 (en) * | 1999-11-01 | 2002-11-05 | Senju Metal Industry Co., Ltd. | Plated electrical leads |
| EP1166938A3 (en) * | 2000-06-30 | 2003-12-17 | Nihon Almit Co.,Ltd. | PB-free soldering alloy |
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