JPS5575421A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5575421A
JPS5575421A JP14782678A JP14782678A JPS5575421A JP S5575421 A JPS5575421 A JP S5575421A JP 14782678 A JP14782678 A JP 14782678A JP 14782678 A JP14782678 A JP 14782678A JP S5575421 A JPS5575421 A JP S5575421A
Authority
JP
Japan
Prior art keywords
epoxy resin
imidazole
oxalic acid
adipic acid
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14782678A
Other languages
Japanese (ja)
Inventor
Kuniaki Tobukuro
Sumiko Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP14782678A priority Critical patent/JPS5575421A/en
Publication of JPS5575421A publication Critical patent/JPS5575421A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: To provide an epoxy resin composition with enhanced hardenability and preserve stability by including a reaction product of imidazole, adipic acid and oxalic acid and benzyl alcohol to epoxy resin.
CONSTITUTION: To epoxy resin, is compounded a reaction product obtained by reacting adipic acid and oxalic acid successively with one or more groups selected from imidazole and imidazole derivative as a hardener. As imidazole derivative to be used, 2-ethylimidazole, 2-ethyl-4-methylimidazole or the like are designated. The reaction mol ratio of adipic acid and oxalic acid to imidazole and the derivative thereof is within the range of 1.80W1.15mol of adipic acid and 0.20W0.85mol of oxalic acid per one mol of imidazoles and the reaction is preferably carried out in the range of 80W15mol% of adipic acid and 20W85mol% of oxalic acid.
COPYRIGHT: (C)1980,JPO&Japio
JP14782678A 1978-12-01 1978-12-01 Epoxy resin composition Pending JPS5575421A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14782678A JPS5575421A (en) 1978-12-01 1978-12-01 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14782678A JPS5575421A (en) 1978-12-01 1978-12-01 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5575421A true JPS5575421A (en) 1980-06-06

Family

ID=15439099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14782678A Pending JPS5575421A (en) 1978-12-01 1978-12-01 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5575421A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255991A (en) * 1994-10-27 1996-10-01 Samsung Electro Mech Co Ltd Method and equipment for manufacturing beat filter
US7148294B2 (en) * 2001-03-30 2006-12-12 Toray Industries, Inc. Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials
EP1646054A4 (en) * 2003-07-11 2010-05-19 Ube Industries BASE AND ACID MIXTURE AND ION CONDUCTOR COMPRISING SAID MIXTURE

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255991A (en) * 1994-10-27 1996-10-01 Samsung Electro Mech Co Ltd Method and equipment for manufacturing beat filter
US7148294B2 (en) * 2001-03-30 2006-12-12 Toray Industries, Inc. Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials
US7501087B2 (en) 2001-03-30 2009-03-10 Toray Industries, Inc. Injection molding thermosetting resin composition into reinforcing fiber substrate
EP1646054A4 (en) * 2003-07-11 2010-05-19 Ube Industries BASE AND ACID MIXTURE AND ION CONDUCTOR COMPRISING SAID MIXTURE
US8308970B2 (en) 2003-07-11 2012-11-13 Ube Industries, Ltd. Acid-base mixture and ion conductor comprising the same

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