JPS5575893A - Production of solder - Google Patents

Production of solder

Info

Publication number
JPS5575893A
JPS5575893A JP14984478A JP14984478A JPS5575893A JP S5575893 A JPS5575893 A JP S5575893A JP 14984478 A JP14984478 A JP 14984478A JP 14984478 A JP14984478 A JP 14984478A JP S5575893 A JPS5575893 A JP S5575893A
Authority
JP
Japan
Prior art keywords
alloy
solder
solder base
phosphorus
joining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14984478A
Other languages
Japanese (ja)
Inventor
Kisaku Nakamura
Akio Hori
Naoyuki Hirate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14984478A priority Critical patent/JPS5575893A/en
Publication of JPS5575893A publication Critical patent/JPS5575893A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)

Abstract

PURPOSE:To apply wetting property to the solder base, and prevent oxidation when melting, by coexisting phosphorus in a solder base of which principal components are Pb and Sn or In, mixing with a specified content of phosphorus. CONSTITUTION:As the solder base to be used, for example, Pb-Sn alloy, Pb-Sn-Ag alloy, Pb-Sn-Sb alloy, and Pb-In alloy may be useful. The coexisting conditions for phosphorus include the method of adding by forming mother alloy with one componet of the solder base, and the method of directly adding phosphorus into the solder base. The solder is melted so that the phosphorous content may be 2- 50ppm. In this method, oxidation of solder base may be prevented, the amount of intermetallic compound included between the joining face and the metal to be joined when joining may be restrained to a minimum, and drop of joining characteristics may be lessened.
JP14984478A 1978-12-04 1978-12-04 Production of solder Pending JPS5575893A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14984478A JPS5575893A (en) 1978-12-04 1978-12-04 Production of solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14984478A JPS5575893A (en) 1978-12-04 1978-12-04 Production of solder

Publications (1)

Publication Number Publication Date
JPS5575893A true JPS5575893A (en) 1980-06-07

Family

ID=15483882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14984478A Pending JPS5575893A (en) 1978-12-04 1978-12-04 Production of solder

Country Status (1)

Country Link
JP (1) JPS5575893A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0168674A1 (en) * 1984-06-28 1986-01-22 Angelo Passini Tin base alloy for soldering, having high resistance to the oxidation in the molten state
WO2003059564A1 (en) 2002-01-10 2003-07-24 Senju Metal Industry Co., Ltd. Soldering method and solder alloy for additional supply
JP2005001000A (en) * 2003-06-13 2005-01-06 Senju Metal Ind Co Ltd Method for increasing effectiveness of material component
JP2015000425A (en) * 2013-06-18 2015-01-05 住友金属鉱山株式会社 Pb solder alloy

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0168674A1 (en) * 1984-06-28 1986-01-22 Angelo Passini Tin base alloy for soldering, having high resistance to the oxidation in the molten state
WO2003059564A1 (en) 2002-01-10 2003-07-24 Senju Metal Industry Co., Ltd. Soldering method and solder alloy for additional supply
US7628308B2 (en) 2002-01-10 2009-12-08 Senju Metal Industry Co., Ltd. Method of replenishing an oxidation suppressing element in a solder bath
JP2005001000A (en) * 2003-06-13 2005-01-06 Senju Metal Ind Co Ltd Method for increasing effectiveness of material component
JP2015000425A (en) * 2013-06-18 2015-01-05 住友金属鉱山株式会社 Pb solder alloy

Similar Documents

Publication Publication Date Title
US5435857A (en) Soldering composition
US5242658A (en) Lead-free alloy containing tin, zinc and indium
JPS5346418A (en) Low melting point alloy
DE2943603A1 (en) SOLDER INSERT
JPS56144893A (en) Solder alloy for fitting lead on silver electrode
DE3830694C2 (en)
JPS57141864A (en) Lead battery
JPS5669341A (en) High temperature solder
JPS5530834A (en) Method of forming ohmic contact in semiconductor pellet
JPS5732346A (en) Mother alloy for oxidation resistant lead-tin solder
KR100333401B1 (en) Lead-Free Alloys for Soldering
JPS5474248A (en) Clad solder
JPS6437077A (en) Reflow soldering
JPS57171571A (en) Joining method for super hard alloy and other metal
KR100337498B1 (en) Lead-Free Alloys for Soldering
KR100337497B1 (en) Lead-Free Alloys for Soldering
CN85100578B (en) The antioxidation plumber solder that contains rare earth element
SU436714A1 (en) Solder for low-temperature soldering
JPS63177995A (en) Alloy powder for solder paste
KR100327767B1 (en) Lead-Free Alloys for Soldering
KR850006778A (en) Soldering of Semiconductor Chips on Metal Substrates for Automatic Assembly of Semiconductor Devices
KR100333402B1 (en) Lead-Free Alloys for Soldering
JPH05185278A (en) Cream solder
JPS6434597A (en) Cu conductive compound with satisfactory solderability
JPS54100941A (en) Low temperature fusion plating material