JPS557853A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS557853A
JPS557853A JP8057078A JP8057078A JPS557853A JP S557853 A JPS557853 A JP S557853A JP 8057078 A JP8057078 A JP 8057078A JP 8057078 A JP8057078 A JP 8057078A JP S557853 A JPS557853 A JP S557853A
Authority
JP
Japan
Prior art keywords
composition
heat
resin composition
solvent
allylphenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8057078A
Other languages
Japanese (ja)
Other versions
JPS5650899B2 (en
Inventor
Shiyuuichi Suzuki
Shinichi Sanada
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8057078A priority Critical patent/JPS557853A/en
Publication of JPS557853A publication Critical patent/JPS557853A/en
Publication of JPS5650899B2 publication Critical patent/JPS5650899B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: The title composition capable of showing improved electrical and mechanical properties even at a high temperature, comprising an α,β-unsaturated compound, an amino group-containing allylphenol compound, an epoxy resin, and a curing agent.
CONSTITUTION: A composition comprising (A) 5W85 wt% of an α,β-unsaturated compound, e.g. (meth)acrylic acid, (B) 5W70 wt% of an amino group-containing allylphenol and/or an allylphenyl ether, (C) 5W80 wt% of an epoxy resin, and (D) 1W1.6 equivalents per epoxy equivalent of a curing agent, e.g. an acid anhydride.
EFFECT: The composition can be used in either of the solvent or solvent-less type with the properties retained even at a high temperature above 150°C.
COPYRIGHT: (C)1980,JPO&Japio
JP8057078A 1978-07-04 1978-07-04 Heat-resistant resin composition Granted JPS557853A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8057078A JPS557853A (en) 1978-07-04 1978-07-04 Heat-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8057078A JPS557853A (en) 1978-07-04 1978-07-04 Heat-resistant resin composition

Publications (2)

Publication Number Publication Date
JPS557853A true JPS557853A (en) 1980-01-21
JPS5650899B2 JPS5650899B2 (en) 1981-12-02

Family

ID=13721988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8057078A Granted JPS557853A (en) 1978-07-04 1978-07-04 Heat-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS557853A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243413A (en) * 1985-08-20 1987-02-25 Hitachi Chem Co Ltd Thermosetting resin composition
US5237042A (en) * 1991-06-12 1993-08-17 Korea Institute Of Science And Technology Process for the preparation of polybutylene terephthalate based polymer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS531297A (en) * 1976-06-25 1978-01-09 Toshiba Chem Corp Heat-resistant resin compositions for molding
JPS5340099A (en) * 1976-09-27 1978-04-12 Toshiba Corp Thermosetting resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS531297A (en) * 1976-06-25 1978-01-09 Toshiba Chem Corp Heat-resistant resin compositions for molding
JPS5340099A (en) * 1976-09-27 1978-04-12 Toshiba Corp Thermosetting resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243413A (en) * 1985-08-20 1987-02-25 Hitachi Chem Co Ltd Thermosetting resin composition
US5237042A (en) * 1991-06-12 1993-08-17 Korea Institute Of Science And Technology Process for the preparation of polybutylene terephthalate based polymer

Also Published As

Publication number Publication date
JPS5650899B2 (en) 1981-12-02

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