JPS558005A - Bonding pad substructure - Google Patents
Bonding pad substructureInfo
- Publication number
- JPS558005A JPS558005A JP7867278A JP7867278A JPS558005A JP S558005 A JPS558005 A JP S558005A JP 7867278 A JP7867278 A JP 7867278A JP 7867278 A JP7867278 A JP 7867278A JP S558005 A JPS558005 A JP S558005A
- Authority
- JP
- Japan
- Prior art keywords
- film
- pad
- bonding pad
- bonding
- metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/981—Auxiliary members, e.g. spacers
- H10W72/983—Reinforcing structures, e.g. collars
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To provide a bonding pad through an insulating film oppositely to a metallic film on a base body in such a manner that the pad is not exfoliated by an external force to be applied at the time of bonding or joining.
CONSTITUTION: After a thin film of permalloy is formed on the surface of a base body 1 of garnet film, it is etched to provide an abnormal bubble controlling film 2 and plural pieces of metallic films 6 which are completely separated from each other (or one another). An insulating film 3 is formed on this, and a bonding pad 4 is provided oppositely to the position of the metallic film 6, and then a protective film 5 is prepared by eliminating the pad section. By employing such a substructure for a bonding pad, it is possible to increase strength of the pad and minimize pad exfoliation problem.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7867278A JPS558005A (en) | 1978-06-30 | 1978-06-30 | Bonding pad substructure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7867278A JPS558005A (en) | 1978-06-30 | 1978-06-30 | Bonding pad substructure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS558005A true JPS558005A (en) | 1980-01-21 |
Family
ID=13668348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7867278A Pending JPS558005A (en) | 1978-06-30 | 1978-06-30 | Bonding pad substructure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS558005A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57200953A (en) * | 1981-06-02 | 1982-12-09 | Toshiba Corp | Optical record carrier reader |
| JPS5892941A (en) * | 1981-11-30 | 1983-06-02 | Shimadzu Corp | Detecting method for stable measurement |
-
1978
- 1978-06-30 JP JP7867278A patent/JPS558005A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57200953A (en) * | 1981-06-02 | 1982-12-09 | Toshiba Corp | Optical record carrier reader |
| JPS5892941A (en) * | 1981-11-30 | 1983-06-02 | Shimadzu Corp | Detecting method for stable measurement |
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