JPS5582039A - Evaluation method of soldering and its unit - Google Patents

Evaluation method of soldering and its unit

Info

Publication number
JPS5582039A
JPS5582039A JP14226578A JP14226578A JPS5582039A JP S5582039 A JPS5582039 A JP S5582039A JP 14226578 A JP14226578 A JP 14226578A JP 14226578 A JP14226578 A JP 14226578A JP S5582039 A JPS5582039 A JP S5582039A
Authority
JP
Japan
Prior art keywords
wetting
soldering
measured object
force
area ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14226578A
Other languages
Japanese (ja)
Other versions
JPS5933214B2 (en
Inventor
Toshihiro Shima
Yoichiro Maehara
Mitsuo Shirata
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14226578A priority Critical patent/JPS5933214B2/en
Publication of JPS5582039A publication Critical patent/JPS5582039A/en
Publication of JPS5933214B2 publication Critical patent/JPS5933214B2/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
    • G01N13/02—Investigating surface tension of liquids
    • G01N2013/0225—Investigating surface tension of liquids of liquid metals or solder

Landscapes

  • Investigating And Analyzing Materials By Characteristic Methods (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To perform wettability of soldering test with high accuracy through multi- dimensional evaluation, by immersing measured object in molten solder, measuring floating force, wetting force and wetting area ratio, and obtaining the value multiplying the measured value.
CONSTITUTION: When the soldering bath 7 is moved and the measured object 5 is immersed in the molten solder 8, it is pushed up with surface tension at first and pushed down with wetting after that. The change in this force is detected with the differential transformer 6 and inputted to the memory circuit 13. Next, the soldering bath 7 is lowered, the measured object 5 is turned with the pulse motor 14, and the output signal of the optical detection set 20 is binarized 22 and fed to the operation circuit 25. The operation circuit 25 evaluates the wetting area ratio in multiple with the relative measurement for the entire wetting process in response to the production mode of the wetting curve to obtain overall evaluation including various factors, allowing to increase the accuracy of the wettability test for soldering.
COPYRIGHT: (C)1980,JPO&Japio
JP14226578A 1978-11-20 1978-11-20 Soldering evaluation method and device Expired JPS5933214B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14226578A JPS5933214B2 (en) 1978-11-20 1978-11-20 Soldering evaluation method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14226578A JPS5933214B2 (en) 1978-11-20 1978-11-20 Soldering evaluation method and device

Publications (2)

Publication Number Publication Date
JPS5582039A true JPS5582039A (en) 1980-06-20
JPS5933214B2 JPS5933214B2 (en) 1984-08-14

Family

ID=15311313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14226578A Expired JPS5933214B2 (en) 1978-11-20 1978-11-20 Soldering evaluation method and device

Country Status (1)

Country Link
JP (1) JPS5933214B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797640U (en) * 1980-12-04 1982-06-16
JPS5797427A (en) * 1980-12-10 1982-06-17 Toshiba Corp Measuring and evaluating device for solderability
US4467638A (en) * 1983-05-13 1984-08-28 Rca Corporation Method and apparatus for quantitatively evaluating the soldering properties of a wave soldering system
US5001923A (en) * 1989-01-13 1991-03-26 Schmitt Thomas Karlheinz G Process to measure the wetting forces between a liquid and a solid body
US5563338A (en) * 1994-06-09 1996-10-08 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and device for measuring wettability under controlled atmosphere
EP0749009A4 (en) * 1994-12-28 1998-12-23 Nihon Almit Co Ltd Solder wettability measuring instrument

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797640U (en) * 1980-12-04 1982-06-16
JPS5797427A (en) * 1980-12-10 1982-06-17 Toshiba Corp Measuring and evaluating device for solderability
US4467638A (en) * 1983-05-13 1984-08-28 Rca Corporation Method and apparatus for quantitatively evaluating the soldering properties of a wave soldering system
US5001923A (en) * 1989-01-13 1991-03-26 Schmitt Thomas Karlheinz G Process to measure the wetting forces between a liquid and a solid body
US5563338A (en) * 1994-06-09 1996-10-08 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and device for measuring wettability under controlled atmosphere
EP0749009A4 (en) * 1994-12-28 1998-12-23 Nihon Almit Co Ltd Solder wettability measuring instrument

Also Published As

Publication number Publication date
JPS5933214B2 (en) 1984-08-14

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