JPS5582454A - Container for integrated circuit element - Google Patents

Container for integrated circuit element

Info

Publication number
JPS5582454A
JPS5582454A JP15602178A JP15602178A JPS5582454A JP S5582454 A JPS5582454 A JP S5582454A JP 15602178 A JP15602178 A JP 15602178A JP 15602178 A JP15602178 A JP 15602178A JP S5582454 A JPS5582454 A JP S5582454A
Authority
JP
Japan
Prior art keywords
plate
electroconductive
integrated circuit
circuit element
fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15602178A
Other languages
Japanese (ja)
Inventor
Toru Furuyama
Susumu Kayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15602178A priority Critical patent/JPS5582454A/en
Publication of JPS5582454A publication Critical patent/JPS5582454A/en
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE: To prevent an integrated circuit element from being affected by power noises, by providing an electroconductive member on a dielectric member at an electroconductive plate to which the integrated circuit element is bonded, opposed each other thru dielectrics, while the electroconductive member is grounded or connected to outside power source.
CONSTITUTION: An electroconductive plate 12 is provided on a base board 11 of ceramic or the like. A dielectric member 13 is provided on the electroconductive plate 12. An electroconductive plate 14 for fitting an integrated circuit element is provided on the dielectric member 13. The integrated circuit element 15 is fitted on the plate 14. Lead wires 16 are connected to the element 15. The electroconductive plate 12 is connected to one lead wire 16 which is grounded or coupled to an external power source. The electroconductive plate 12 may be provided over the fitting plate 14 to face it. A plurality of electrocondutive members 12 may be provided. As a result, a large electrostatic capacity is established between the fitting plate 14 and the electroconductive plate 12. The noises of a power source couple to the fitting plate 14 are greatly reduced through the electrostatic capacity.
COPYRIGHT: (C)1980,JPO&Japio
JP15602178A 1978-12-15 1978-12-15 Container for integrated circuit element Pending JPS5582454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15602178A JPS5582454A (en) 1978-12-15 1978-12-15 Container for integrated circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15602178A JPS5582454A (en) 1978-12-15 1978-12-15 Container for integrated circuit element

Publications (1)

Publication Number Publication Date
JPS5582454A true JPS5582454A (en) 1980-06-21

Family

ID=15618573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15602178A Pending JPS5582454A (en) 1978-12-15 1978-12-15 Container for integrated circuit element

Country Status (1)

Country Link
JP (1) JPS5582454A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821848A (en) * 1981-07-31 1983-02-08 Nec Corp Container for integrated circuit device
JPS58500734A (en) * 1981-05-06 1983-05-06 ウエスタ−ン　エレクトリツク　カムパニ−，インコ−ポレ−テツド Package for semiconductor chips
JPS5887852A (en) * 1981-11-20 1983-05-25 Matsushita Electric Ind Co Ltd Composite integrated device
JPS5895063U (en) * 1981-12-21 1983-06-28 ニチコン株式会社 hybrid integrated circuit
JPS6139551A (en) * 1984-05-25 1986-02-25 コンパニイ・ダンフオルマテイク・ミリテ−ル・スパテイアル・エ・アエロノ−テイク Potential distributing device and case for electronic constituent containing same device
US5223735A (en) * 1988-09-30 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device in which circuit functions can be remedied or changed and the method for producing the same
US6459143B2 (en) * 1999-09-07 2002-10-01 National Semiconductor Corporation Method of packaging fuses

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58500734A (en) * 1981-05-06 1983-05-06 ウエスタ−ン　エレクトリツク　カムパニ−，インコ−ポレ−テツド Package for semiconductor chips
JPS5821848A (en) * 1981-07-31 1983-02-08 Nec Corp Container for integrated circuit device
JPS5887852A (en) * 1981-11-20 1983-05-25 Matsushita Electric Ind Co Ltd Composite integrated device
JPS5895063U (en) * 1981-12-21 1983-06-28 ニチコン株式会社 hybrid integrated circuit
JPS6139551A (en) * 1984-05-25 1986-02-25 コンパニイ・ダンフオルマテイク・ミリテ−ル・スパテイアル・エ・アエロノ−テイク Potential distributing device and case for electronic constituent containing same device
US5223735A (en) * 1988-09-30 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device in which circuit functions can be remedied or changed and the method for producing the same
US6459143B2 (en) * 1999-09-07 2002-10-01 National Semiconductor Corporation Method of packaging fuses

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