JPS5585601A - Thermal expansion adjusting material and production thereof - Google Patents
Thermal expansion adjusting material and production thereofInfo
- Publication number
- JPS5585601A JPS5585601A JP15879478A JP15879478A JPS5585601A JP S5585601 A JPS5585601 A JP S5585601A JP 15879478 A JP15879478 A JP 15879478A JP 15879478 A JP15879478 A JP 15879478A JP S5585601 A JPS5585601 A JP S5585601A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- thermal expansion
- copper
- invar alloy
- adjusting material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title abstract 4
- 239000010949 copper Substances 0.000 abstract 7
- 239000000843 powder Substances 0.000 abstract 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 5
- 229910052802 copper Inorganic materials 0.000 abstract 5
- 229910001374 Invar Inorganic materials 0.000 abstract 4
- 239000000956 alloy Substances 0.000 abstract 4
- 229910045601 alloy Inorganic materials 0.000 abstract 4
- 238000005245 sintering Methods 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000007740 vapor deposition Methods 0.000 abstract 1
Landscapes
- Powder Metallurgy (AREA)
Abstract
PURPOSE: To produce thermal expansion adjusting material excelling in thermal conduction and small in coefficient of thermal expansion, by mixing the powder of invar alloy coated with copper on the surface and the powder of copper, and sintering after forming by compressing the green compact.
CONSTITUTION: The surface of powder of invar alloy containing Fe by 64wt% and Ni by 36% is coated with Cu by plating or vapor deposition, or other method. This powder of copper coated invar alloy is mixed with powder of copper by 30W 60% rate uniformly. After forming to a certain form by compressing this mixture powder, it is put in a sintering furnace to be heated to 650W800°C up to 30min to be sintered. Thus, Ni, in the invar alloy is diffused in the Cu powder to be bonded. This sintered material is rolled, drawn, compressed and otherwise processed, and is then annealed at 650W800°C up to 30min. Thus is obtained a thermal expansion adjusting material of which is high conductivity and low coefficient of thermal expansion, which is suited to bonding of silicon wafer with copper leads.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53158794A JPS5830940B2 (en) | 1978-12-21 | 1978-12-21 | Thermal expansion adjustment material and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53158794A JPS5830940B2 (en) | 1978-12-21 | 1978-12-21 | Thermal expansion adjustment material and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5585601A true JPS5585601A (en) | 1980-06-27 |
| JPS5830940B2 JPS5830940B2 (en) | 1983-07-02 |
Family
ID=15679478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53158794A Expired JPS5830940B2 (en) | 1978-12-21 | 1978-12-21 | Thermal expansion adjustment material and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5830940B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0347944A (en) * | 1989-07-14 | 1991-02-28 | Sumitomo Metal Ind Ltd | Substrate material for heat radiation |
| GB2242912A (en) * | 1989-08-29 | 1991-10-16 | Hitachi Powdered Metals | Sintered coated metal powder |
| CN102588428A (en) * | 2005-01-05 | 2012-07-18 | Ntn株式会社 | Fluid lubrication bearing device and motor having the same |
| CN103924153A (en) * | 2014-04-22 | 2014-07-16 | 钢铁研究总院 | Low-expansion magnetic shielding alloy and preparation method thereof |
| CN110899692A (en) * | 2019-11-29 | 2020-03-24 | 安徽工业大学 | Preparation method of iron-based alloy powder |
| CN113667852A (en) * | 2021-09-03 | 2021-11-19 | 合肥工业大学 | A kind of powder metallurgy preparation method of high thermal conductivity Cu-Invar bimetallic matrix composite material |
-
1978
- 1978-12-21 JP JP53158794A patent/JPS5830940B2/en not_active Expired
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0347944A (en) * | 1989-07-14 | 1991-02-28 | Sumitomo Metal Ind Ltd | Substrate material for heat radiation |
| GB2242912A (en) * | 1989-08-29 | 1991-10-16 | Hitachi Powdered Metals | Sintered coated metal powder |
| GB2242912B (en) * | 1989-08-29 | 1993-10-27 | Hitachi Powdered Metals | Method for making sintered parts |
| CN102588428A (en) * | 2005-01-05 | 2012-07-18 | Ntn株式会社 | Fluid lubrication bearing device and motor having the same |
| CN103924153A (en) * | 2014-04-22 | 2014-07-16 | 钢铁研究总院 | Low-expansion magnetic shielding alloy and preparation method thereof |
| CN110899692A (en) * | 2019-11-29 | 2020-03-24 | 安徽工业大学 | Preparation method of iron-based alloy powder |
| CN113667852A (en) * | 2021-09-03 | 2021-11-19 | 合肥工业大学 | A kind of powder metallurgy preparation method of high thermal conductivity Cu-Invar bimetallic matrix composite material |
| CN113667852B (en) * | 2021-09-03 | 2022-05-31 | 合肥工业大学 | Powder metallurgy preparation method of high-thermal-conductivity Cu-Invar bimetal-based composite material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5830940B2 (en) | 1983-07-02 |
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